Effects of homogenization temperature on creep performance of laser powder bed fusion-fabricated Inconel 718 at 650? | |
Ma, Tao1; Zhang, Guang-Ping2; Tan, Ping3; Zhang, Bin1 | |
通讯作者 | Zhang, Bin(zhangb@atm.neu.edu.cn) |
2022-09-15 | |
发表期刊 | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
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ISSN | 0921-5093 |
卷号 | 853页码:12 |
摘要 | The effect of homogenization temperature (1000 ?, 1100 ? and 1200 ?) on creep performance of laser powder bed fusion-fabricated Inconel 718 at 650 ? was investigated utilizing the small punch creep test method and the small punch creep specimens loaded perpendicular to the building direction, which can well reflect the comprehensive performance of the specimen in all radial directions of the circular plane parallel to the building direction. The results show that the specimen homogenized at 1100? for 1 h followed by double-aging treatment exhibited better creep performance than the other two ones homogenized at 1000 ? and 1200?. Such enhancement of the creep performance is attributed to fewer crack initiation sites, the higher GB sliding rate near the precipitates at grain boundaries to release stress concentrations, the higher strengthening effect of gamma & PRIME;& PRIME; phases in grains, and the more effective resistance to cracking by the special GBs than the other specimens. The basic mechanism for the small punch creep of laser powder bed fusion-fabricated Inconel 718 at 650 ? was elucidated by the careful characterization of the microstructures and theoretical calculations. A feasible ho-mogenization strategy for further improving the SPC performance of laser powder bed fusion-fabricated Inconel 718 alloy is to make the specimen have fewer and smaller granular precipitates at GBs, and more tortuous GBs by introducing more special GBs with considering the grain size. Such a key point can be used to determine the appropriate subsequent heat treatment for laser powder bed fusion thin-walled Inconel 718 component. |
关键词 | Selective laser melting Inconel 718 Homogenization Small punch creep Crack initiation Cracking resistance |
资助者 | National Natural Science Foundation of China (NSFC) ; Fundamental Research Project of Shenyang National Laboratory for Materials Science |
DOI | 10.1016/j.msea.2022.143794 |
收录类别 | SCI |
语种 | 英语 |
资助项目 | National Natural Science Foundation of China (NSFC)[52171128] ; National Natural Science Foundation of China (NSFC)[51771207] ; Fundamental Research Project of Shenyang National Laboratory for Materials Science[L2019R18] |
WOS研究方向 | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
WOS类目 | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS记录号 | WOS:000843470300001 |
出版者 | ELSEVIER SCIENCE SA |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/174513 |
专题 | 中国科学院金属研究所 |
通讯作者 | Zhang, Bin |
作者单位 | 1.Northeastern Univ, Sch Mat Sci & Engn, Key Lab Anisotropy & Texture Mat, Minist Educ, 3-11 Wenhua Rd, Shenyang 110819, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China 3.Northwest Inst Nonferrous Met Res, 96 Wei Yang Rd, Xian 710016, Peoples R China |
推荐引用方式 GB/T 7714 | Ma, Tao,Zhang, Guang-Ping,Tan, Ping,et al. Effects of homogenization temperature on creep performance of laser powder bed fusion-fabricated Inconel 718 at 650?[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2022,853:12. |
APA | Ma, Tao,Zhang, Guang-Ping,Tan, Ping,&Zhang, Bin.(2022).Effects of homogenization temperature on creep performance of laser powder bed fusion-fabricated Inconel 718 at 650?.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,853,12. |
MLA | Ma, Tao,et al."Effects of homogenization temperature on creep performance of laser powder bed fusion-fabricated Inconel 718 at 650?".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 853(2022):12. |
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