Mechanism of notch sensitivity elimination via precipitating Laves phases at grain boundaries in a low expansion superalloy (vol 18, pg 3094, 2022)

doi:10.1016/j.jmrt.2022.06.107

IMR OpenIR

	Mechanism of notch sensitivity elimination via precipitating Laves phases at grain boundaries in a low expansion superalloy (vol 18, pg 3094, 2022)
	Zhang, Weiwei 1,2; Tan, Yuanguo 3; Xin, Xin 1,2; Sun, Wenru 1,2
Corresponding Author	Xin, Xin(xxin@imr.ac.cn) ; Sun, Wenru(wrsun@imr.ac.cn)
	2022-07-01
Source Publication	JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
ISSN	2238-7854
Volume	19 Pages:5068-5068
DOI	10.1016/j.jmrt.2022.06.107
Indexed By	SCI
Language	英语
WOS Research Area	Materials Science ; Metallurgy & Metallurgical Engineering
WOS Subject	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS ID	WOS:000859710300003
Publisher	ELSEVIER
Citation statistics
Document Type	期刊论文
Identifier	http://ir.imr.ac.cn/handle/321006/176367
Collection	中国科学院金属研究所
Corresponding Author	Xin, Xin; Sun, Wenru
Affiliation	1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 3.Univ Southampton, Fac Engn & Environm, Mech Engn Grp, Southampton, Hants, England
Recommended Citation GB/T 7714	Zhang, Weiwei,Tan, Yuanguo,Xin, Xin,et al. Mechanism of notch sensitivity elimination via precipitating Laves phases at grain boundaries in a low expansion superalloy (vol 18, pg 3094, 2022)[J]. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2022,19:5068-5068.
APA	Zhang, Weiwei,Tan, Yuanguo,Xin, Xin,&Sun, Wenru.(2022).Mechanism of notch sensitivity elimination via precipitating Laves phases at grain boundaries in a low expansion superalloy (vol 18, pg 3094, 2022).JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,19,5068-5068.
MLA	Zhang, Weiwei,et al."Mechanism of notch sensitivity elimination via precipitating Laves phases at grain boundaries in a low expansion superalloy (vol 18, pg 3094, 2022)".JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T 19(2022):5068-5068.

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