| Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications | |
| Chen, Biao1,2; Sui, Simi1,3; He, Fang1; He, Chunnian1,2,4; Cheng, Hui-Ming5,6; Qiao, Shi-Zhang7; Hu, Wenbin1,2,4; Zhao, Naiqin1,2 | |
| Corresponding Author | He, Fang(fanghe@tju.edu.cn) ; Qiao, Shi-Zhang(s.qiao@adelaide.edu.au) ; Hu, Wenbin(wbhu@tju.edu.cn) |
| 2023-11-13 | |
| Source Publication | CHEMICAL SOCIETY REVIEWS
 |
| ISSN | 0306-0012 |
| Volume | 52Issue:22Pages:7802-7847 |
| Abstract | To support the global goal of carbon neutrality, numerous efforts have been devoted to the advancement of electrochemical energy conversion (EEC) and electrochemical energy storage (EES) technologies. For these technologies, transition metal dichalcogenide/carbon (TMDC/C) heterostructures have emerged as promising candidates for both electrode materials and electrocatalysts over the past decade, due to their complementary advantages. It is worth noting that interfacial properties play a crucial role in establishing the overall electrochemical characteristics of TMDC/C heterostructures. However, despite the significant scientific contribution in this area, a systematic understanding of TMDC/C heterostructures' interfacial engineering is currently lacking. This literature review aims to focus on three types of interfacial engineering, namely interfacial orientation engineering, interfacial stacking engineering, and interfacial doping engineering, of TMDC/C heterostructures for their potential applications in EES and EEC devices. To accomplish this goal, a combination of experimental and theoretical approaches was used to allow the analysis and summary of the fundamental electrochemical properties and preparation strategies of TMDC/C heterostructures. Moreover, this review highlights the design and utilization of the interfacial engineering of TMDC/C heterostructures for specific EES and EEC devices. Finally, the challenges and opportunities of using interfacial engineering of TMDC/C heterostructures in practical EES and EEC devices are outlined. We expect that this review will effectively guide readers in their understanding, design, and application of interfacial engineering of TMDC/C heterostructures. This review provides a fundamental understanding of three types of interfacial engineering in TMDC/C heterostructures and provides guidance for designing interfacial engineering in TMDC/C heterostructures for electrochemical energy applications. |
| Funding Organization | This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745) ; National Natural Science Foundation of China ; Young Elite Scientists Sponsorship Program by CAS ; Guangdong Basic and Applied Basic Research Foundation |
| DOI | 10.1039/d3cs00445g |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745)[51972225] ; This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745)[51972226] ; This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745)[52202281] ; National Natural Science Foundation of China[2022QNRC001] ; Young Elite Scientists Sponsorship Program by CAS[2020A1515110745] ; Guangdong Basic and Applied Basic Research Foundation |
| WOS Research Area | Chemistry |
| WOS Subject | Chemistry, Multidisciplinary |
| WOS ID | WOS:001087688100001 |
| Publisher | ROYAL SOC CHEMISTRY |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/177841 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | He, Fang; Qiao, Shi-Zhang; Hu, Wenbin |
| Affiliation | 1.Tianjin Univ, Tianjin Key Lab Composite & Funct Mat, Key Lab Adv Ceram & Machining Technol, Sch Mat Sci & Engn,Minist Educ, Tianjin 300350, Peoples R China 2.Tianjin Univ, Natl Ind Educ Platform Energy Storage, 135 Yaguan Rd, Tianjin 300350, Peoples R China 3.Hebei Univ Technol, Sch Mat Sci & Engn, Tianjin Key Lab Mat Laminating Fabricat & Interfac, Tianjin 300401, Peoples R China 4.Tianjin Univ, Joint Sch Natl Univ Singapore & Tianjin Univ, Int Campus, Fuzhou 350207, Peoples R China 5.Chinese Acad Sci, Inst Technol Carbon Neutral, Shenzhen Inst Adv Technol, Fac Mat Sci & Energy Engn, Shenzhen 518055, Peoples R China 6.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 7.Univ Adelaide, Sch Chem Engn & Adv Mat, Adelaide, SA 5005, Australia |
| Recommended Citation GB/T 7714 | Chen, Biao,Sui, Simi,He, Fang,et al. Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications[J]. CHEMICAL SOCIETY REVIEWS,2023,52(22):7802-7847. |
| APA | Chen, Biao.,Sui, Simi.,He, Fang.,He, Chunnian.,Cheng, Hui-Ming.,...&Zhao, Naiqin.(2023).Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications.CHEMICAL SOCIETY REVIEWS,52(22),7802-7847. |
| MLA | Chen, Biao,et al."Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications".CHEMICAL SOCIETY REVIEWS 52.22(2023):7802-7847. |
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