Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint

doi:10.1007/s10854-022-09646-z

IMR OpenIR

	Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint
	Bashir, M. Nasir 1,2; Khan, Abdul Faheem 3; Bashir, Shahid 4; Bashir, Mohamed Bashir Ali 2; Jamshaid, Muhammad 5; Javed, Iqra 6; Ali, Imran 7
通讯作者	Bashir, M. Nasir(mnasir@ceme.nust.edu.pk)
	2023-02-01
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	34 期号:5 页码:9
摘要	Downscaling of electronic devices increased the current density in the solder joint. High current density causes the rapid diffusion of Cu atoms which is the root cause of failure in lead-free solder joints. This study aims the investigation of the effects of Zn nanoparticles (NP) doped flux on the microstructure of SAC305 solder joint under high current. Electromigration (EM) test was conducted for SAC305 solder and SAC305 + 2 wt% Zn NP-doped solder joints at different time intervals of 192, 384, 768, and 1128 h under a current density of 1 x 10(4) A/cm(2). The temperature was maintained at 80 +/- 5 degrees C in the silicon oil bath during the EM test. The results showed that Zn NP-doped reduced the size of the interfacial IMC of the SAC305 solder joint after the reflow process. After the EM test, the cracks and damages were suppressed, and thickness variations at the cathode and anode were significantly controlled by adding Zn NP-doped flux into the SAC305 solder joint.
DOI	10.1007/s10854-022-09646-z
收录类别	SCI
语种	英语
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:001011056700009
出版者	SPRINGER
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/178592
专题	中国科学院金属研究所
通讯作者	Bashir, M. Nasir
作者单位	1.Natl Univ Sci & Technol, Islamabad, Pakistan 2.Jouf Univ, Coll Engn, Dept Mech Engn, Sakaka 72388, Saudi Arabia 3.Inst Space Technol, Dept Mat Sci & Engn, 1 Natl Highway, Islamabad 44000, Pakistan 4.Univ Malaya, Higher Inst Ctr Excellence HICoE, UM Power Energy Dedicated Adv Ctr UMPEDAC, Wisma R&D, Level 4, Kuala Lumpur 59990, Malaysia 5.Bahauddin Zakariya Univ Multan, Fac Engn & Technol, Dept Mech Engn, Multan 60000, Pakistan 6.Univ Management & Technol, Sch Sci & Technol, Lahore, Pakistan 7.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Bashir, M. Nasir,Khan, Abdul Faheem,Bashir, Shahid,et al. Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2023,34(5):9.
APA	Bashir, M. Nasir.,Khan, Abdul Faheem.,Bashir, Shahid.,Bashir, Mohamed Bashir Ali.,Jamshaid, Muhammad.,...&Ali, Imran.(2023).Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,34(5),9.
MLA	Bashir, M. Nasir,et al."Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 34.5(2023):9.