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Interface strain gradient enabled high strength and hardening in laminated nanotwinned Cu
Cheng, Zhao1; Wan, Tao1,2; Lu, Lei1
Corresponding AuthorLu, Lei(llu@imr.ac.cn)
2023-09-01
Source PublicationACTA MATERIALIA
ISSN1359-6454
Volume256Pages:10
AbstractInterfaces play a crucial role in mechanical behaviors of laminated materials. In this study, a series of hard/soft nanotwinned Cu laminates with varying interface spacing from 200 to 33 & mu;m are prepared by means of direct current electrodeposition. Simultaneous improvement of strength and work hardening with decreasing interface spacing is found in tensile tests. Extra strengthening and geometrically necessary dislocations (GNDs), but without any strain concentration, are found in the vicinity of interfaces. An obvious strain discrepancy appears across the interface and decreases with decreasing interface spacing. Most importantly, a highest plastic strain gradient appearing in the vicinity of interfaces, regardless of interface spacing, indicates a significant deformation compatibility across the interfaces. The spatially-distributed strengthening mediated by interface contributes for increasing strength and decreasing strain discrepancy by decreasing the interface spacing.
KeywordLaminated nanotwin Cu Extra strengthening Interface strain gradient Geometrically necessary dislocation Interface spacing
Funding OrganizationNational Natural Science Foundation of China (NSFC) ; Key Research Program of Frontier Science and International partnership program ; Youth Innovation Promotion Association, Chinese Academy of Sciences (CAS)
DOI10.1016/j.actamat.2023.119138
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China (NSFC)[51931010] ; National Natural Science Foundation of China (NSFC)[92163202] ; Key Research Program of Frontier Science and International partnership program[GJHZ2029] ; Youth Innovation Promotion Association, Chinese Academy of Sciences (CAS) ; [52001312]
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:001039831400001
PublisherPERGAMON-ELSEVIER SCIENCE LTD
Citation statistics
Cited Times:22[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/178775
Collection中国科学院金属研究所
Corresponding AuthorLu, Lei
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang, Peoples R China
Recommended Citation
GB/T 7714
Cheng, Zhao,Wan, Tao,Lu, Lei. Interface strain gradient enabled high strength and hardening in laminated nanotwinned Cu[J]. ACTA MATERIALIA,2023,256:10.
APA Cheng, Zhao,Wan, Tao,&Lu, Lei.(2023).Interface strain gradient enabled high strength and hardening in laminated nanotwinned Cu.ACTA MATERIALIA,256,10.
MLA Cheng, Zhao,et al."Interface strain gradient enabled high strength and hardening in laminated nanotwinned Cu".ACTA MATERIALIA 256(2023):10.
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