Microstructure evolution and interfacial healing mechanism of heterogeneous interfaces in Ni-Co based superalloys during hot compression bonding

doi:10.1016/j.matchar.2024.114658

IMR OpenIR

	Microstructure evolution and interfacial healing mechanism of heterogeneous interfaces in Ni-Co based superalloys during hot compression bonding
	Ren, Shaofei 1,2,3; Xiao, He 1,2,3; Wu, Shengqing 1,2,3; Zeng, Chenqi 1,2,3; Bai, Xiaolong 4; Liu, Sheng 5; Xu, Bin 1,3; Cui, Chuanyong 6; Ma, Guangcai 3; Sun, Mingyue 1,3
通讯作者	Xu, Bin() ; Sun, Mingyue(mysun@imr.ac.cn)
	2025-02-01
发表期刊	MATERIALS CHARACTERIZATION
ISSN	1044-5803
卷号	220 页码:13
摘要	This study focuses on the microstructural evolution of heterogeneous interfaces and healing mechanism of bonding interfaces of Ni-Co based superalloys during hot compression bonding. The coarse and fine grain sides show distinct refinement mechanisms during hot deformation. The coarse grain side refines the grains mainly through deformation twins and deformation microbands, and the residual primary gamma' phase also facilitates the recrystallization through particle-stimulated nucleation mechanism. Continuous dynamic recrystallization through in-situ transformation of dislocation cells into high angle grain boundaries also contributes to the formation of necklace-like recrystallization on coarse grain side. The grains on the fine-grain side are further refined mainly by strain-induced discontinuous dynamic recrystallization. Dislocation density gradients induced by heterogeneous deformation drive migration of bonding interfaces across interfacial oxides from fine to coarse grain side during hot deformation. As the deformation strain increases, the migrating interfaces form the first layer of necklace-like recrystallization on coarse grain side due to deformation uncoordinated. Further increasing the deformation strain, the local deformation leads to continuous expansion of necklace-like recrystallized grains in deformed grains and refined recrystallized grains. The testing of mechanical properties indicate that the heterogeneous interface achieves complete healing, which provides a new idea for fabrication of dual microstructure turbine disks.
关键词	Hot compression bonding Bonding interface Continuous dynamic recrystallization Necklace-like recrystallization Interface healing
资助者	National Key Research and Development Program ; National Natural Science Foundation of China ; LingChuang Research Project of China National Nuclear Corporation ; CNNC Science Fund for Talented Young Scholars
DOI	10.1016/j.matchar.2024.114658
收录类别	SCI
语种	英语
资助项目	National Key Research and Development Program[2024YFB3714200] ; National Natural Science Foundation of China[52173305] ; National Natural Science Foundation of China[52101061] ; National Natural Science Foundation of China[52233017] ; National Natural Science Foundation of China[52203384] ; National Natural Science Foundation of China[U244120568] ; LingChuang Research Project of China National Nuclear Corporation ; CNNC Science Fund for Talented Young Scholars
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Materials Science, Characterization & Testing
WOS记录号	WOS:001393928500001
出版者	ELSEVIER SCIENCE INC
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/180920
专题	中国科学院金属研究所
通讯作者	Xu, Bin; Sun, Mingyue
作者单位	1.Chinese Acad Sci, Key Lab Nucl Mat & Safety Assessment, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 4.China United Gas Turbine Technol CO LTD, Beijing 100016, Peoples R China 5.Suzhou Lab, SIP, 388 Ruoshui St, Suzhou 215123, Jiangsu, Peoples R China 6.Chinese Acad Sci, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Ren, Shaofei,Xiao, He,Wu, Shengqing,et al. Microstructure evolution and interfacial healing mechanism of heterogeneous interfaces in Ni-Co based superalloys during hot compression bonding[J]. MATERIALS CHARACTERIZATION,2025,220:13.
APA	Ren, Shaofei.,Xiao, He.,Wu, Shengqing.,Zeng, Chenqi.,Bai, Xiaolong.,...&Sun, Mingyue.(2025).Microstructure evolution and interfacial healing mechanism of heterogeneous interfaces in Ni-Co based superalloys during hot compression bonding.MATERIALS CHARACTERIZATION,220,13.
MLA	Ren, Shaofei,et al."Microstructure evolution and interfacial healing mechanism of heterogeneous interfaces in Ni-Co based superalloys during hot compression bonding".MATERIALS CHARACTERIZATION 220(2025):13.