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Interface healing mechanism of fine-grained Ni-Co-based superalloy during hot-compression bonding
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2024, 卷号: 173, 页码: 45-53
Authors:
Ren, Shaofei
;
Bai, Xiaolong
;
Liu, Sheng
;
Sun, Mingyue
;
Xu, Bin
;
Cui, Chuanyong
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Submit date：2024/01/08
Hot-compression bonding
Ni-Co-based superalloy
Discontinuous dynamic recrystallization
Heterogeneous epitaxial recrystallization
