Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays

doi:10.1016/j.applthermaleng.2024.125258

IMR OpenIR

	Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays
	Wu, Zhitao 1; Wang, Wendong 2,3; Bao, Ding 1; Wei, Song 1,2; Li, Ruifeng 1; Guo, Jingdong 3
通讯作者	Wei, Song(weisong@guet.edu.cn) ; Li, Ruifeng(liruifeng8107@163.com) ; Guo, Jingdong(jdguo@imr.ac.cn)
	2025-03-15
发表期刊	APPLIED THERMAL ENGINEERING
ISSN	1359-4311
卷号	263 页码:11
摘要	Gallium-based liquid metals have notable advantages as thermal-interface materials (TIMs) in high-power electronics. Nevertheless, several crucial issues require attention, as the considerable fluidity of liquid metals may cause leakage through gaps between chips and heat sinks, posing the risk of short circuits in electronic components. Gallium and its alloys exhibit poor substrate wettability, giving rise to voids or weak bonds. Additionally, the annual production of gallium is limited, thereby necessitating the minimisation of its consumption. Therefore, this paper proposes a thermal interconnection structure with liquid metal as the heattransfer medium. A non-contact jetting technology was adopted to fabricate arrays of eutectic gallium-indium (EGaIn) alloy microdroplets, and a porous steel mesh was used to prevent unregulated flow of the liquid metal. Using a hydrogen chloride atmosphere enhanced the wetting characteristics of the liquid metal on the copper substrates. As the structured copper sheets were pressed together, the liquid metal did not escape, and a well-connected liquid-metal thermal interface layer was formed. Coupled with the encapsulation insulation protection, the issue of liquid metal leakage has been completely resolved. The total thermal resistance of the developed thermal interconnection structure was 2.5-3 K center dot mm2/W, which is considerably lower than that of conventional polymer-based TIMs, demonstrating superior heat-transfer performance in the practical powerdevice applications.
关键词	Liquid metal Thermal-interface material Non-contact jetting Wetting characteristic Heat-transfer performance
资助者	National Natural Science Foun-dation of China ; Guangxi Nat-ural Science Foundation ; Guangxi Science and Technology Program ; Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology
DOI	10.1016/j.applthermaleng.2024.125258
收录类别	SCI
语种	英语
资助项目	National Natural Science Foun-dation of China[52105327] ; National Natural Science Foun-dation of China[51971231] ; Guangxi Nat-ural Science Foundation[2020GXNSFBA2297109] ; Guangxi Science and Technology Program[AD20297023] ; Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology[22-35-4-S018]
WOS研究方向	Thermodynamics ; Energy & Fuels ; Engineering ; Mechanics
WOS类目	Thermodynamics ; Energy & Fuels ; Engineering, Mechanical ; Mechanics
WOS记录号	WOS:001397606200001
出版者	PERGAMON-ELSEVIER SCIENCE LTD
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/180973
专题	中国科学院金属研究所
通讯作者	Wei, Song; Li, Ruifeng; Guo, Jingdong
作者单位	1.Guilin Univ Elect Technol, Sch Mech & Elect Engn, Guilin 541000, Peoples R China 2.Xi An Jiao Tong Univ, Shaoxing Tongyue Semicond Inst, Shaoxing 312000, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Wu, Zhitao,Wang, Wendong,Bao, Ding,et al. Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays[J]. APPLIED THERMAL ENGINEERING,2025,263:11.
APA	Wu, Zhitao,Wang, Wendong,Bao, Ding,Wei, Song,Li, Ruifeng,&Guo, Jingdong.(2025).Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays.APPLIED THERMAL ENGINEERING,263,11.
MLA	Wu, Zhitao,et al."Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays".APPLIED THERMAL ENGINEERING 263(2025):11.