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Controlling the Residual Stress in Metallic Solids by Pulsed Electric Current 期刊论文
ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 5, 页码: 581-598
Authors:  Zhang Xinfang;  Xiang Siqi;  Yi Kun;  Guo Jingdong
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high energy pulsed electric current  low energy continuous pulsed electric current  residual stress  electroplasticity  multi-field coupling  
Fabrication of high-conductivity RGO film at a temperature lower than 1500 degrees C by electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 10
Authors:  Lv, Meijuan;  Wei, Qinwei;  Cao, Shuo;  Guo, Jingdong;  Ren, Wencai;  Cheng, Huiming
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Highly solderability of FeP film in contact with SnAgCu solder 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
Authors:  Zhou, Haifei;  Guo, Jingdong;  Shang, Jianku;  Song, Xiaoning
Favorite  |  View/Download:58/0  |  Submit date:2021/02/02
Solderability  Electroless FeP  SnAgCu  Oxidation  
A new insight into promotion action of Co2+ in Ni-diamond composite electrodeposition 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 8, 页码: 1797-1802
Authors:  Zhou, Haifei;  Du, Nan;  Guo, Jingdong;  Liu, Shuan
Favorite  |  View/Download:45/0  |  Submit date:2021/02/02
Cobalt sulfate  Composite electrodeposition  Ni-diamond  Zero charge potential  Particle content in deposits  
A new insight into promotion action of Co2+ in Ni-diamond composite electrodeposition 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 8, 页码: 1797-1802
Authors:  Zhou, Haifei;  Du, Nan;  Guo, Jingdong;  Liu, Shuan
Favorite  |  View/Download:46/0  |  Submit date:2021/02/02
Cobalt sulfate  Composite electrodeposition  Ni-diamond  Zero charge potential  Particle content in deposits  
Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 11, 页码: 10233-10243
Authors:  Yu, Zifeng;  Wei, Song;  Guo, Jingdong
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一种定向生长的铜柱凸点互连结构及其制备方法 专利
专利类型: 发明专利, 专利号: 201410709245.1, 申请日期: 2018-04-24,
Inventors:  刘志权;  孙福龙;  李财富;  祝清省;  郭敬东
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一种以FeP合金作为接焊层的凸点封装结构 专利
专利类型: 发明专利, 专利号: 201310416014.7, 申请日期: 2017-09-26,
Inventors:  郭敬东;  周海飞;  祝清省;  刘志权
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一种以FeNi合金或FeNiP合金作为反应界面层的柱状凸点封装结构 专利
专利类型: 发明专利, 专利号: 201310415003.7, 申请日期: 2017-08-25,
Inventors:  刘志权;  郭敬东;  祝清省;  曹丽华
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力电热多场耦合作用下微电子产品可靠性测试平台 专利
专利类型: 发明专利, 专利号: 201210563644.2, 申请日期: 2017-06-23,
Inventors:  崔学顺;  郭敬东;  祝清省;  刘志权;  吴迪;  张磊;  曹丽华
Favorite  |  View/Download:76/0  |  Submit date:2021/02/02