Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials

doi:10.1007/s10854-024-12848-2

IMR OpenIR

	Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials
	Wang, Wendong 1,2; Wei, Song 3; Du, Xinyu 4; Zhu, Qingsheng 1,2; Qiao, Yanxin 4; Wang, Xiaojing 4; Guo, Jingdong 1,2
通讯作者	Wei, Song(swei2020@126.com) ; Guo, Jingdong(jdguo@imr.ac.cn)
	2024-06-01
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	35 期号:16 页码:16
摘要	Liquid metal-based thermal interface materials (TIMs) have garnered attention in the field of microelectronics due to their flowability and high thermal conductivity. In this study, Composite TIMs were developed using EGa-In-Sn (eutectic gallium-indium-tin) alloy and tungsten particles through a stirred grinding method. The effect of tungsten particle content on the thermal performance of the TIMs was investigated. Finite element analysis was employed to analyze the internal heat transfer behavior. Results demonstrated that the thermal conductivity of the composite TIMs initially increased and then decreased with increasing tungsten particle content, reaching a peak at nearly twice that of EGa-In-Sn alloy. The established two-dimensional model aligned with experimental data, facilitating predictions for the thermal conductivity of composite TIMs. Interconnected tungsten particles formed the primary heat flux channel, while voids impeded the heat flux. Particle spacing, contact mode and void size are the main factors affecting the heat conduction between tungsten particles.
资助者	National Natural Science Foundation of China
DOI	10.1007/s10854-024-12848-2
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:001243368800002
出版者	SPRINGER
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/186887
专题	中国科学院金属研究所
通讯作者	Wei, Song; Guo, Jingdong
作者单位	1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Guilin Univ Elect Technol, Guangxi Key Lab Mfg Syst & Adv Mfg Technol, Guilin 541004, Peoples R China 4.Jiangsu Univ Sci & Technol, Coll Mat Sci & Engn, Zhenjiang 212001, Peoples R China
推荐引用方式 GB/T 7714	Wang, Wendong,Wei, Song,Du, Xinyu,et al. Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(16):16.
APA	Wang, Wendong.,Wei, Song.,Du, Xinyu.,Zhu, Qingsheng.,Qiao, Yanxin.,...&Guo, Jingdong.(2024).Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,35(16),16.
MLA	Wang, Wendong,et al."Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 35.16(2024):16.