Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic

doi:10.1016/j.ceramint.2023.11.170

IMR OpenIR

	Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic
	Ye, C. C.1,2; Ma, K.3; Chen, H. M.1; Xiang, Z. L.1; Wei, W. Q.1
通讯作者	Ye, C. C.(ychao333@wfu.edu.cn) ; Wei, W. Q.()
	2024-01-15
发表期刊	CERAMICS INTERNATIONAL
ISSN	0272-8842
卷号	50 期号:2 页码:4014-4021
摘要	In this study investigated the texture, microstructure, and mechanical behavior of silicon nitride (Si3N4) ceramics were investigated using various techniques, including the orientation distribution function, X-ray diffraction, scanning electron microscopy and transmission electron microscopy. The orientation distribution of c-axis of the beta-Si3N4 phase derived from the hot-press sintering method, where the considerable orientation arrangement of grains was perpendicular (SPE sample) and parallel (SPA sample) to the hot-pressed direction. XRD analysis showed that the SPA sample had stronger {0001}<10-10> and {0001}<2-1-10> textures than those of the SPE sample. For these reasons, the SPE sample exhibited a lower thermal conductivity of 54 W (m K)(-1) than that of the SPA sample (91 W (m K)(-1)). The mechanical behavior of the Si3N4 ceramics was affected by the orientation arrangement of the grains. Analysis of the cracks on the surface of the Si3N4 ceramics at different indentation angles (0 degrees, 22.5 degrees, 45 degrees, and 67.5 degrees), revealed a rising tendency of fracture toughness in the Si3N4 ceramics, with values of 3.6 MPa m(1/2), 4.1 MPa m(1/2), 5.5 MPa m(1/2) and 6.1 MPa m(1/2), respectively. These results were attributed to the texture and close-packed hexagonal structure.
关键词	Texture Silicon nitride Thermal conductivity Fracture toughness
资助者	China Scholarship Council (CSC) ; Weifang Science and Technology Development Foundation
DOI	10.1016/j.ceramint.2023.11.170
收录类别	SCI
语种	英语
资助项目	China Scholarship Council (CSC) ; Weifang Science and Technology Development Foundation[2021GX001]
WOS研究方向	Materials Science
WOS类目	Materials Science, Ceramics
WOS记录号	WOS:001135724100001
出版者	ELSEVIER SCI LTD
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/183209
专题	中国科学院金属研究所
通讯作者	Ye, C. C.; Wei, W. Q.
作者单位	1.Weifang Univ, Sch Machinery & Automat, Weifang 261061, Shandong, Peoples R China 2.Nankai Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Ye, C. C.,Ma, K.,Chen, H. M.,et al. Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic[J]. CERAMICS INTERNATIONAL,2024,50(2):4014-4021.
APA	Ye, C. C.,Ma, K.,Chen, H. M.,Xiang, Z. L.,&Wei, W. Q..(2024).Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic.CERAMICS INTERNATIONAL,50(2),4014-4021.
MLA	Ye, C. C.,et al."Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic".CERAMICS INTERNATIONAL 50.2(2024):4014-4021.