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压痕诱发GaAs和Si晶体塑性、损伤与断裂
徐永波
2009-11-15
Source Publication无机材料学报
Issue6Pages:1081-1089
Abstract对压痕诱发脆性材料塑性、损伤与断裂研究进行总结,并结合与之有关学科研究进展予以评述.主要结果:微压痕诱导硅和砷化镓晶体的纳米和非晶转变,并发现这一转变的临界应力;转变过程是由切应力,并非静水压力控制;电子辐照诱导非晶晶化,并发现晶化临界条件;晶化速率与电流密度有关;压痕诱发的裂纹尖端不是原子尖的,其萌生与扩展伴随位错的产生,并由此引发点阵的畸变,并产生1~2nm宽非晶带;裂纹扩展沿非晶带发生,而非裂端前方原子键相继断裂的结果;经傅立叶变换和逆变换发现,裂纹尖端变形显示出各向异性.
description.department中国科学院金属研究所沈阳国家材料科学实验室;
Keyword微压痕 高分辨电镜 晶化与非晶化 裂纹尖端结构 傅立叶变换与逆变换
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/23947
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
徐永波. 压痕诱发GaAs和Si晶体塑性、损伤与断裂[J]. 无机材料学报,2009(6):1081-1089.
APA 徐永波.(2009).压痕诱发GaAs和Si晶体塑性、损伤与断裂.无机材料学报(6),1081-1089.
MLA 徐永波."压痕诱发GaAs和Si晶体塑性、损伤与断裂".无机材料学报 .6(2009):1081-1089.
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