| Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing |
| X. H. An; S. Qu; S. D. Wu; Z. F. Zhang
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| 2011
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| 发表期刊 | Journal of Materials Research
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| ISSN | 0884-2914
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| 卷号 | 26期号:3页码:407-415 |
| 摘要 | Effects of stacking fault energy (SFE) on the thermal stability and mechanical properties of nanostructured (NS) Cu-Al alloys during thermal annealing were investigated in this study. Compared with NS Cu-5at.% Al alloy with the higher SFE, NS Cu-8at.% Al alloy exhibits the lower critical temperatures for the initiation of recrystallization and the transition from recovery-dominated to recrystallization-dominated process, which significantly signals its low thermal stability. This may be attributed to the large microstructural heterogeneities resulting from severe plastic deformation. With increasing the annealing temperatures, both Cu-Al alloys present the similar trend of decreased strength and improved ductility. Meanwhile, the remarkable enhancement of uniform elongation is achieved when the volume fraction of Static recrystallization (SRX) grains exceeds similar to 80%. Moreover, the better strength-ductility combination was achieved in the Cu-8at.% Al alloy with lower SFE. |
| 部门归属 | [an, x. h.; qu, s.; wu, s. d.; zhang, z. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;wu, sd (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;shdwu@imr.ac.cn zhfzhang@imr.ac.cn
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| 关键词 | Electron Backscatter Diffraction
Dynamic Plastic-deformation
Aluminum
Single-crystals
Microstructural Evolution
Ultrahigh-strength
Grain-refinement
Shear Bands
Copper
Recrystallization
Ductility
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| URL | 查看原文
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| WOS记录号 | WOS:000292823200007
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| 引用统计 |
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/30237
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
X. H. An,S. Qu,S. D. Wu,et al. Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing[J]. Journal of Materials Research,2011,26(3):407-415.
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| APA |
X. H. An,S. Qu,S. D. Wu,&Z. F. Zhang.(2011).Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing.Journal of Materials Research,26(3),407-415.
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| MLA |
X. H. An,et al."Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing".Journal of Materials Research 26.3(2011):407-415.
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