| Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating | |
| C. Chen; L. Zhang; Q. Q. Lai; C. F. Li; J. K. Shang | |
| 2011 | |
| 发表期刊 | Journal of Materials Science-Materials in Electronics
 |
| ISSN | 0957-4522 |
| 卷号 | 22期号:9页码:1234-1238 |
| 摘要 | Solder wettability of Sn/FeNi plated on copper coupon after various aging conditions was tested by the wetting balance method to investigate the influence of interfacial intermetallic compound (I-IMC) growth on the solderability of tinned FeNi plating. The wetting force was found to decrease slightly with the growth of a primary FeSn(2) layer at the Sn/FeNi interface. Subsequent growth of a CuNiSn compound layer over FeSn(2) improved wettability, resulting in an increase of the wetting force by 0.035 +/- A 0.005 N/m. The results indicated that the evolution of the solder wettability was related to different I-IMCs sequentially formed at the Sn/FeNi interface. |
| 部门归属 | [chen, cai; zhang, lei; lai, qingquan; li, caifu; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, l (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;lzhang@imr.ac.cn |
| 关键词 | Thin-films Sn-ag Alloy Cu Systems Fe-42ni Copper Ni Intermetallics Solderability |
| URL | 查看原文 |
| WOS记录号 | WOS:000293773500007 |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.imr.ac.cn/handle/321006/30250 |
| 专题 | 中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | C. Chen,L. Zhang,Q. Q. Lai,et al. Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating[J]. Journal of Materials Science-Materials in Electronics,2011,22(9):1234-1238. |
| APA | C. Chen,L. Zhang,Q. Q. Lai,C. F. Li,&J. K. Shang.(2011).Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating.Journal of Materials Science-Materials in Electronics,22(9),1234-1238. |
| MLA | C. Chen,et al."Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating".Journal of Materials Science-Materials in Electronics 22.9(2011):1234-1238. |
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