Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current

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	Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current
	H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. K. Shang
	2011
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	528 期号:3 页码:1467-1471
摘要	The effect of electromigration on stress relaxation behavior of pure tin solder joints was investigated. It was found that the stress relaxation rate was accelerated significantly after the sample was subjected to current stressing. The accelerating effect increased with the current stressing time. Measurements of the activation energy and stress exponent suggested that the dominant mechanism of the stress relaxation of pure tin solder joint went from dislocation climb to grain boundary diffusion after electromigration. As a result of grain boundary diffusion and sliding, grain boundary grooves were observed on the surface of the tin solder joints after electromigration. The groove was associated with the divergence of vacancy concentration at the grain boundaries. The vacancy concentration at the grain boundaries, which increased with the current stressing time, promoted the atomic diffusion along the grain boundaries, resulting in a higher stress relaxation rate. (C) 2010 Elsevier B.V. All rights reserved.
部门归属	[liu, h. y.; zhu, q. s.; wang, z. g.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhu, qs (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;qszhu@imr.ac.cn jkshang@imr.ac.cn
关键词	Electromigration Groove Stress Relaxation Grain Boundary Diffusion Tin Single Crystals Creep-behavior Solder Joints Electromigration Ag Microstructure Deformation
URL	查看原文
WOS记录号	WOS:000286904300097
引用统计	被引频次：19[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/30531
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Y. Liu,Q. S. Zhu,Z. G. Wang,et al. Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2011,528(3):1467-1471.
APA	H. Y. Liu,Q. S. Zhu,Z. G. Wang,&J. K. Shang.(2011).Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,528(3),1467-1471.
MLA	H. Y. Liu,et al."Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 528.3(2011):1467-1471.