| Deposition, structure and hardness of Ti-Cu-N hard films prepared by pulse biased arc ion plating | |
| X. Q. Wang; Y. H. Zhao; B. H. Yu; J. Q. Xiao; F. Q. Li | |
| 2011 | |
| 发表期刊 | Vacuum
 |
| ISSN | 0042-207X |
| 卷号 | 86期号:4页码:415-421 |
| 摘要 | In this work, Ti-Cu-N hard nanocomposite films were deposited on 304 stainless steel (SS) substrate by using pulse biased arc ion plating system with Ti-Cu alloy target. The effects of negative substrate pulse bias voltages on chemical composition, structure, morphology and mechanical properties were investigated. The composition and structure of these films was found to be dependent on the pulse bias, whereas the pulse biases put little influence on hardness of these films. The XPS spectra of Cu 2p showed that obtained peak values correspond to pure metallic Cu. Cu content in Ti-Cu-N nanocomposite films changed with pulse bias voltage. In addition, X-ray diffraction analysis showed that a pronounced TiN (111) texture is observed under low pulse bias voltage while it changed to TiN (220) orientation under high pulse bias voltage. Surface roughness of the Ti-Cu-N nanocomposite films achieved to the minimum value of 0.11 mu m with the negative pulse bias voltage of 600 V. The average grain size of TiN was less than 17 nm. The mechanical properties of Ti-Cu-N hard films investigated by nanoindentation revealed that the hardness was about 22-24 GPa and the hardness enhancement was not obtained. Crown Copyright (C) 2011 Published by Elsevier Ltd. All rights reserved. |
| 部门归属 | [zhao, y. h.; yu, b. h.; xiao, j. q.] chinese acad sci, inst met res, shenyang 110016, peoples r china. [wang, x. q.; li, f. q.] shenyang ligong univ, shenyang 110168, peoples r china.;zhao, yh (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china;yhzhao@imr.ac.cn |
| 关键词 | Ti-cu-n Hard Composite Films Pulse Biased Arc Ion Plating Composition Structure Superhard Nanocomposite Coatings Mechanical-properties Zr Bombardment Design Energy Ptsi Dc |
| URL | 查看原文 |
| WOS记录号 | WOS:000298212000012 |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.imr.ac.cn/handle/321006/30748 |
| 专题 | 中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. Q. Wang,Y. H. Zhao,B. H. Yu,et al. Deposition, structure and hardness of Ti-Cu-N hard films prepared by pulse biased arc ion plating[J]. Vacuum,2011,86(4):415-421. |
| APA | X. Q. Wang,Y. H. Zhao,B. H. Yu,J. Q. Xiao,&F. Q. Li.(2011).Deposition, structure and hardness of Ti-Cu-N hard films prepared by pulse biased arc ion plating.Vacuum,86(4),415-421. |
| MLA | X. Q. Wang,et al."Deposition, structure and hardness of Ti-Cu-N hard films prepared by pulse biased arc ion plating".Vacuum 86.4(2011):415-421. |
| 条目包含的文件 | ||||||
| 文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
| Depositionstructure （1001KB） | 开放获取 | -- | ||||
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论