Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature

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	Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature
	F. Yan; H. W. Zhang; N. R. Tao; K. Lu
	2011
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	27 期号:8 页码:673-679
摘要	A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy (TEM) assisted by convergent beam electron diffraction (CBED) analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries (<15 degrees) that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect Sigma 3 coincidence (60 degrees/< 111 >) up to the maximum angle of 9 degrees. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship.
部门归属	[yan, f.; zhang, h. w.; tao, n. r.; lu, k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, hw (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;hwzhang@imr.ac.cn
关键词	Quantitative Structural Characterization Cu Dynamic Plastic Deformation Transmission Electron Microscopy Convergent Beam Electron Diffraction Channel Angular Extrusion Fine Grained Copper Ultra-high Strains Mechanical-properties Thermal-stability Rate Sensitivity Stored Energy Evolution Strength Size
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WOS记录号	WOS:000295111000001
引用统计	被引频次：27[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/30808
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	F. Yan,H. W. Zhang,N. R. Tao,et al. Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature[J]. Journal of Materials Science & Technology,2011,27(8):673-679.
APA	F. Yan,H. W. Zhang,N. R. Tao,&K. Lu.(2011).Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature.Journal of Materials Science & Technology,27(8),673-679.
MLA	F. Yan,et al."Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature".Journal of Materials Science & Technology 27.8(2011):673-679.