Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

IMR OpenIR

	Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern
	W. Liu; L. Zhang; K. J. Hsia; J. K. Shang
	2010
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	26 期号:12 页码:1143-1147
摘要	The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H(2) 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.
部门归属	[liu, wei; zhang, lei; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [hsia, k. j.] univ illinois, dept mech sci & engn, urbana, il 61801 usa. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;jkshang@illinois.edu
关键词	Wetting Reactive Wetting Spreading Solder Thin Film Pattern Liquid Film Morphological Wetting Transitions Structured Surfaces Eutectic Snpb Films
URL	查看原文
WOS记录号	WOS:000286153900015
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31309
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	W. Liu,L. Zhang,K. J. Hsia,et al. Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern[J]. Journal of Materials Science & Technology,2010,26(12):1143-1147.
APA	W. Liu,L. Zhang,K. J. Hsia,&J. K. Shang.(2010).Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern.Journal of Materials Science & Technology,26(12),1143-1147.
MLA	W. Liu,et al."Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern".Journal of Materials Science & Technology 26.12(2010):1143-1147.