Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films

IMR OpenIR

	Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films
	W. Liu; L. Zhang; J. K. Shang
	2010
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	26 期号:3 页码:200-205
摘要	The thermodynamic conditions for dewetting of a liquid solder drop on copper thin films were examined under a hot-stage optical microscope in a flowing protective atmosphere. Dewetting of liquid solder was found to depend strongly on the copper film thickness and preceded by spalling of Cu(6)Sn(5) intermetallic compounds. However, the loss of interfacial bonding by spalling was not sufficient to cause immediate dewetting of solder drops if the wetting tip was still strongly bonded to the copper film. By introducing a pinning force on the wetting front, a sufficient condition was found from a force balance analysis for dewetting of the liquid solder drop, in general agreement with the experimental results.
部门归属	[liu, wei; zhang, lei; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@illinois.edu
关键词	Dewetting Solder Spalling Film Thickness Sn Technology Metallurgy Joints Pb
URL	查看原文
WOS记录号	WOS:000276780100002
引用统计	被引频次：5[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31310
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	W. Liu,L. Zhang,J. K. Shang. Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films[J]. Journal of Materials Science & Technology,2010,26(3):200-205.
APA	W. Liu,L. Zhang,&J. K. Shang.(2010).Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films.Journal of Materials Science & Technology,26(3),200-205.
MLA	W. Liu,et al."Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films".Journal of Materials Science & Technology 26.3(2010):200-205.