Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu)

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	Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu); Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu)
	H. F. Zou; Z. F. Zhang
	2010 ; 2010
发表期刊	Journal of Applied Physics ; Journal of Applied Physics
ISSN	0021-8979 ; 0021-8979
卷号	108 期号:10
摘要	In the current study, the orientation distribution and formation mechanism of intermetallic compounds (IMCs) at heterogeneous interfaces (Sn/Ag or Sn/Cu) were investigated by using electron backscatter diffraction (EBSD) method. The EBSD orientation maps have revealed that some special orientation relationships exist not only at the interfaces between the faceted IMC and (001) or (111) single crystal substrates but also at the interfaces of the scalloplike IMC/(011) single crystal substrate, which are attributed to the low misfit between the IMC and the substrates. However, only part of special orientation relationships can be obtained by using the pole figure when a large number of IMC grains were considered. The reason is that the single crystal substrate can supply more immobile atoms for these special orientated IMC cluster. With increasing the reflowing or aging time, the orientation relationship has no obvious change between the IMC and the single crystal substrates. Meanwhile, it is found that the determinative factor controlling the IMC morphology should include two kinds of interfacial energies at the interfaces of IMC/ solder and IMC/ substrate. The variations in the interfacial energies would induce the transformation of the IMC morphology. These experimental results would be helpful for better understanding on the formation mechanisms of IMCs at the interfaces of Sn/crystals and promoting the wide application of EBSD to study the orientation relationships at other heterogeneous interfaces. (C) 2010 American Institute of Physics. [doi:10.1063/1.3505796]; In the current study, the orientation distribution and formation mechanism of intermetallic compounds (IMCs) at heterogeneous interfaces (Sn/Ag or Sn/Cu) were investigated by using electron backscatter diffraction (EBSD) method. The EBSD orientation maps have revealed that some special orientation relationships exist not only at the interfaces between the faceted IMC and (001) or (111) single crystal substrates but also at the interfaces of the scalloplike IMC/(011) single crystal substrate, which are attributed to the low misfit between the IMC and the substrates. However, only part of special orientation relationships can be obtained by using the pole figure when a large number of IMC grains were considered. The reason is that the single crystal substrate can supply more immobile atoms for these special orientated IMC cluster. With increasing the reflowing or aging time, the orientation relationship has no obvious change between the IMC and the single crystal substrates. Meanwhile, it is found that the determinative factor controlling the IMC morphology should include two kinds of interfacial energies at the interfaces of IMC/ solder and IMC/ substrate. The variations in the interfacial energies would induce the transformation of the IMC morphology. These experimental results would be helpful for better understanding on the formation mechanisms of IMCs at the interfaces of Sn/crystals and promoting the wide application of EBSD to study the orientation relationships at other heterogeneous interfaces. (C) 2010 American Institute of Physics. [doi:10.1063/1.3505796]
部门归属	[zou, h. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zou, h. f.; zhang, z. f.] sci & technol reliabil phys & applicat elect comp, guangzhou 51060, guangdong, peoples r china.;zou, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn ; [zou, h. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zou, h. f.; zhang, z. f.] sci & technol reliabil phys & applicat elect comp, guangzhou 51060, guangdong, peoples r china.;zou, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Lead-free Solders Lead-free Solders Microstructural Evolution Microstructural Evolution Molten Sn Molten Sn Ebsd Ebsd Morphology Morphology Texture Texture Crystal Crystal Alloys Alloys Growth Growth Joints Joints
URL	查看原文 ; 查看原文
WOS记录号	WOS:000285005000058 ; WOS:000285005000058
引用统计	被引频次：21[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31806
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,Z. F. Zhang. Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu), Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu)[J]. Journal of Applied Physics, Journal of Applied Physics,2010, 2010,108, 108(10).
APA	H. F. Zou,&Z. F. Zhang.(2010).Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu).Journal of Applied Physics,108(10).
MLA	H. F. Zou,et al."Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu)".Journal of Applied Physics 108.10(2010).