Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints

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	Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints
	X. N. Du; J. D. Guo; J. K. Shang
	2009
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	38 期号:11 页码:2398-2404
摘要	The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu(3)Sn and Cu(6)Sn(5) intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140A degrees C, the thickness of the Cu(6)Sn(5) IMC at the anode increased significantly. Sn(3)Sb(2) IMC coarsened in the Cu(6)Sn(5) IMC at the anode and in the beta-Sn at the cathode. The possible mechanism of the electromigration effect is discussed.
部门归属	[du, x. n.; guo, j. d.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;du, xn (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jdguo@imr.ac.cn
关键词	Electromigration Solder Joint Intermetallic Compound Lead-free Solders Alloy Interconnects Technology Bump
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WOS记录号	WOS:000270634800025
引用统计	被引频次：5[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31881
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. N. Du,J. D. Guo,J. K. Shang. Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints[J]. Journal of Electronic Materials,2009,38(11):2398-2404.
APA	X. N. Du,J. D. Guo,&J. K. Shang.(2009).Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints.Journal of Electronic Materials,38(11),2398-2404.
MLA	X. N. Du,et al."Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints".Journal of Electronic Materials 38.11(2009):2398-2404.