TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface

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	TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface
	P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
	2009
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	38 期号:12 页码:2579-2584
摘要	The microstructure of the eutectic SnBi/Cu interface was investigated by transmission electron microscopy to study the growth mechanisms of the intermetallic compounds (IMCs). Although the growth kinetics of the total IMC layer were similar, the individual Cu(3)Sn layer grew faster on polycrystalline Cu than on single-crystal substrates. It was found that, on polycrystalline Cu, newly formed Cu(3)Sn grains with a smaller grain size nucleated and grew at both the Cu/Cu(3)Sn and Cu(3)Sn/Cu(6)Sn(5) interfaces during reflow and solid-state aging. The consumption of Cu(6)Sn(5) to form Cu(3)Sn was faster at the Cu(3)Sn/Cu(6)Sn(5) interface. While on single-crystal Cu new Cu(3)Sn grains nucleated only at the Cu/Cu(3)Sn interface, the directional growth of the initial columnar Cu(3)Sn controlled the advance of the Cu(3)Sn/Cu(6)Sn(5) interface.
部门归属	[shang, p. j.; liu, z. q.; li, d. x.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, pj (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zqliu@imr.ac.cn jkshang@uiuc.edu
关键词	Intermetallic Compound (Imc) Snbi Solder Interface Diffusion Growth Mechanism Reactive Interface Solder Joints Molten Sn Cu-sn Technology Kinetics
URL	查看原文
WOS记录号	WOS:000272301900020
引用统计	被引频次：42[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32261
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	P. J. Shang,Z. Q. Liu,D. X. Li,et al. TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface[J]. Journal of Electronic Materials,2009,38(12):2579-2584.
APA	P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2009).TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface.Journal of Electronic Materials,38(12),2579-2584.
MLA	P. J. Shang,et al."TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface".Journal of Electronic Materials 38.12(2009):2579-2584.