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Observations of continuous tin whisker growth in NdSn(3) intermetallic compound
A. P. Xian; M. Liu
2009
发表期刊Journal of Materials Research
ISSN0884-2914
卷号24期号:9页码:2775-2783
摘要In situ observation of tin whisker growth in NdSn(3) compound was carried out by using an optical microscope (OM) and scanning electron microscopy (SEM). The growth rate of Sn-whisker from NdSn(3) is shown to be rapid (approximately 8-15 A/s) during exposure to room ambience, and it is accompanied by formation of a new compound, Nd(OH)(3), as was confirmed by x-ray diffraction. This reaction between the Sn-RE compound and trace water in room ambience has significant influence on whisker growth. There is an electron irradiation effect on whisker growth; that is, whiskers stopped growing after being observed in SEM. Therefore, it is suggested that OM be used rather than SEM to observe the continuous whisker growth. In discussion, the driving force per Sn atom for whisker growth is estimated as 1 x 10(14) N in accordance with the whisker growth rate, and its apparent force originates from a chemical potential gradient between the released Sri atoms and the whisker.
部门归属[xian, ai-ping; liu, meng] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;xian, ap (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;ap.xian@imr.ac.cn
关键词Sn Mechanism Finishes Surface Alloys Cu
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文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/32441
专题中国科学院金属研究所
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A. P. Xian,M. Liu. Observations of continuous tin whisker growth in NdSn(3) intermetallic compound[J]. Journal of Materials Research,2009,24(9):2775-2783.
APA A. P. Xian,&M. Liu.(2009).Observations of continuous tin whisker growth in NdSn(3) intermetallic compound.Journal of Materials Research,24(9),2775-2783.
MLA A. P. Xian,et al."Observations of continuous tin whisker growth in NdSn(3) intermetallic compound".Journal of Materials Research 24.9(2009):2775-2783.
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