Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization

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	Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization
	X. F. Zhang; J. D. Guo; J. K. Shang
	2009
发表期刊	Journal of Alloys and Compounds
ISSN	0925-8388
卷号	487 期号:1-2 页码:776-780
摘要	Interfacial reactions and growth kinetics of intermetallic compound layers formed between Sn-9Zn solder and electroplated Fe-42Ni metallization were investigated after ageing at 120,150 and 170 degrees C for up to 360 h. Experimental results show that the intermetallic compound formed at the interface was mainly delta-FeZn(8.87) phase, rather than the FeSn(2) phase. The reason is that the attraction between Zn and Fe is stronger than that of Sn and Fe. The growth exponent n for delta-FeZn(8.87) phase was found to be about 0.5, indicating that it grew by a diffusion-controlled process. The activation energy for the growth of delta-FeZn(8.87) phase was determined to be 42 kJ/mol, which is in good agreement with the reported data. Crown Copyright (C) 2009 Published by Elsevier B.V. All rights reserved.
部门归属	[zhang, x. f.; guo, j. d.; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;jkshang@imr.ac.cn
关键词	Intermetallics Kinetics Interfacial Reactions Feni Activation Energy Zn Based Solders Ni-p/au Layer Interfacial Reactions Sn-ag Cu Electromigration Interconnect Microstructure Substrate Alloys
URL	查看原文
WOS记录号	WOS:000272521900150
引用统计	被引频次：11[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32575
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. F. Zhang,J. D. Guo,J. K. Shang. Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization[J]. Journal of Alloys and Compounds,2009,487(1-2):776-780.
APA	X. F. Zhang,J. D. Guo,&J. K. Shang.(2009).Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization.Journal of Alloys and Compounds,487(1-2),776-780.
MLA	X. F. Zhang,et al."Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization".Journal of Alloys and Compounds 487.1-2(2009):776-780.