| Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect | |
| X. F. Zhang; J. D. Guo; J. K. Shang | |
| 2009 | |
| Source Publication | Journal of Electronic Materials
 |
| ISSN | 0361-5235 |
| Volume | 38Issue:3Pages:425-429 |
| Abstract | Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 x 10(4) A/cm(2) for 168.5 h at 150A degrees C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni(5)Zn(21) and Cu(5)Zn(8) were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a thicker Cu(6)Sn(5) phase replaced the Ni(5)Zn(21) phase at the Ni/Sn-Zn interface, whereas at the Cu/Sn-Zn interface, a thicker beta-CuZn phase replaced the Cu(5)Zn(8) phase. |
| description.department | [zhang, x. f.; guo, j. d.; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhang, xf (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;jdguo@imr.ac.cn |
| Keyword | Electromigration Coupling Effect Polarity Intermetallic Compound Interfacial Reaction Zn Based Solders Ni-p/au Layer Cross-interaction Intermetallic Compounds Bump Metallization Eutectic Snpb Sn-9zn Solder Cu Joints Combination |
| URL | 查看原文 |
| WOS ID | WOS:000263145100007 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/32577 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect[J]. Journal of Electronic Materials,2009,38(3):425-429. |
| APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2009).Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect.Journal of Electronic Materials,38(3),425-429. |
| MLA | X. F. Zhang,et al."Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect".Journal of Electronic Materials 38.3(2009):425-429. |
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