Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate

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	Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate
	H. F. Zou; Q. K. Zhang; Z. F. Zhang
	2009
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	61 期号:3 页码:308-311
摘要	The segregation of Bi at the Cu/Cu(3)Sn interfaces of the SnBi/Cu couple dramatically decreases this couple's mechanical properties. Here, we deliberately add Ag, Al, Sn and Zn elements into the Cu substrate to eliminate the interfacial segregation and embittlement of the SnBi/Cu couple. Experimental results confirmed that there is always a perfect Cu(3)Sn/Cu alloy interface without Bi segregation, and excellent mechanical properties are thus maintained. The most important finding is that the interfacial embrittlement of SnBi/Cu alloy joints was successfully eliminated even after prolonged aging. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[zou, h. f.; zhang, q. k.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Bi Interfacial Segregation Embrittlement Pb-free Solder Interfacial Strength Soldering Copper Grain-boundaries Fracture Boron Chemistry Ni3al
URL	查看原文
WOS记录号	WOS:000266788200021
引用统计	被引频次：41[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32643
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,Q. K. Zhang,Z. F. Zhang. Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate[J]. Scripta Materialia,2009,61(3):308-311.
APA	H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2009).Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate.Scripta Materialia,61(3),308-311.
MLA	H. F. Zou,et al."Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate".Scripta Materialia 61.3(2009):308-311.