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Whisker growth on tin finishes of different electrolytes
B. Jiang; A. P. Man
2008
发表期刊Microelectronics Reliability
ISSN0026-2714
卷号48期号:1页码:105-110
摘要Whisker growth on tin finishes produced by three different plating baths (sulfate-based, alkaline stannate-based and stannous chloride-based) was observed by both optical and scanning electronic microscopy (SEM), the results showed that whisker growth on the finish plated by alkaline stannate bath is easier and faster than that on the finish plated by sulfate-based bath or stannous chloride-based bath. Furthermore, the alkaline stannate bath showed the lowest cathode current efficiency, and micro-nodules were observed after plating when using this bath. The reason for alkaline stannate bath to promote whisker growth is also discussed. (c) 2007 Elsevier Ltd. All rights reserved.
部门归属[jiang, bo; man, ai-ping] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;man, ap (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, 72 wenhua rd, shenyang 110016, peoples r china;ap.xian@imr.ac.cn
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WOS记录号WOS:000254372300011
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被引频次:18[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/32844
专题中国科学院金属研究所
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B. Jiang,A. P. Man. Whisker growth on tin finishes of different electrolytes[J]. Microelectronics Reliability,2008,48(1):105-110.
APA B. Jiang,&A. P. Man.(2008).Whisker growth on tin finishes of different electrolytes.Microelectronics Reliability,48(1),105-110.
MLA B. Jiang,et al."Whisker growth on tin finishes of different electrolytes".Microelectronics Reliability 48.1(2008):105-110.
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