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The influence of Si distribution and content on the thermoelectric properties of SiC foam ceramics
W. Wei; X. M. Cao; C. Tian; J. S. Zhang
2008
发表期刊Microporous and Mesoporous Materials
ISSN1387-1811
卷号112期号:1-3页码:521-525
摘要SiC foam ceramics were prepared by macromolecule pyrogenation combined with reaction bonding methods. The thermoelectric properties of SiC foams with different strut layer structures (formed by different Si distribution) containing 8% and 15% Si have been measured from room temperature up to 873 K. The results show that the electrical resistivity of SiC foam ceramics varies evidently with the strut layer structures and Si content. Also, there is a strong influence of the strut layer structures oil Seebeck coefficients for SiC foam ceramics. SiC foam with a three-layer strut structure exhibits the highest value of the power factor, which leads to an improvement of the thermoelectric properties of SiC foam ceramics. (C) 2007 Elsevier Inc. All rights reserved.
部门归属[wei, wei; cao, xiao-ming; tian, chong; zhang, jin-song] chinese acad sci, inst met res, shenyang 110016, peoples r china.;zhang, js (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china, peoples r china;jshzhang@imr.ac.cn
关键词Sic Foam Ceramics Strut Layer Structures Si Content Power Factor Thermoelectric Properties Temperature Alloys
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WOS记录号WOS:000256713300058
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被引频次:15[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/33189
专题中国科学院金属研究所
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W. Wei,X. M. Cao,C. Tian,et al. The influence of Si distribution and content on the thermoelectric properties of SiC foam ceramics[J]. Microporous and Mesoporous Materials,2008,112(1-3):521-525.
APA W. Wei,X. M. Cao,C. Tian,&J. S. Zhang.(2008).The influence of Si distribution and content on the thermoelectric properties of SiC foam ceramics.Microporous and Mesoporous Materials,112(1-3),521-525.
MLA W. Wei,et al."The influence of Si distribution and content on the thermoelectric properties of SiC foam ceramics".Microporous and Mesoporous Materials 112.1-3(2008):521-525.
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