Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites

IMR OpenIR

	Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites
	J. Zhang; Y. C. Zhou
	2008
发表期刊	Journal of Materials Research
ISSN	0884-2914
卷号	23 期号:4 页码:924-932
摘要	Two kinds of composites (i.e., conductive and strong Cu-Ti3AlC2 composites) were prepared at 850 degrees C, while high-strength in situ Cu-TiCx composites were prepared by consolidation at 850 degrees C and then hot pressing at 1000 degrees C. In both kinds of composites, the reinforcements were uniformly distributed within the Cu matrix. In Cu-Ti3AlC2 composites, strengthening was achieved by the load transfer through a strong interfacial layer consisting of TiCx and Cu(Al), which was formed by the partial deintercalation of Al from Ti3AlC2. For the in situ Cu-TiCx composites, the higher modulus of TiCx as well as the highly twinned structure formed during processing contributed to the enhancement of strength. It was demonstrated that the deintercalation of Al from Ti3AlC2 formed substoichiometric Ti3AlC2 (With x < 1), and no detrimental effect on the electrical conductivity was observed.
部门归属	[zhang, j.; zhou, y. c.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zhang, j.] chinese acad sci, grad sch, beijing 100039, peoples r china.;zhou, yc (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;yczhou@imr.ac.cn
关键词	Liquid Reaction Synthesis Copper Matrix Composites Polycrystalline Ti3sic2 Ti3alc2 Stability Deformation Ceramics Behavior Ti2snc Alloys
URL	查看原文
WOS记录号	WOS:000254684500007
引用统计	被引频次：65[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/33321
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. Zhang,Y. C. Zhou. Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites[J]. Journal of Materials Research,2008,23(4):924-932.
APA	J. Zhang,&Y. C. Zhou.(2008).Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites.Journal of Materials Research,23(4),924-932.
MLA	J. Zhang,et al."Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites".Journal of Materials Research 23.4(2008):924-932.