Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

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	Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect; Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect
	X. F. Zhang; J. D. Guo; J. K. Shang
	2007 ; 2007
发表期刊	Scripta Materialia ; Scripta Materialia
ISSN	1359-6462 ; 1359-6462
卷号	57 期号:6 页码:513-516
摘要	Interfacial reactions in a eutectic Sn-Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 x 10(4) A cm(-2) for 166 h, an abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was about 2.3 mu m thicker than that at the anode. Upon increasing the temperature to about 185 degrees C, Cu-Zn compounds were replaced by Cu-Sn compounds at the anode and by a mixture of Cu-Zn and Cu-Sn compounds at the cathode. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.; Interfacial reactions in a eutectic Sn-Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 x 10(4) A cm(-2) for 166 h, an abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was about 2.3 mu m thicker than that at the anode. Upon increasing the temperature to about 185 degrees C, Cu-Zn compounds were replaced by Cu-Sn compounds at the anode and by a mixture of Cu-Zn and Cu-Sn compounds at the cathode. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;guo, jd (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jdguo@imr.ac.cn ; chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. univ illinois, dept mat sci & engn, urbana, il 61801 usa.;guo, jd (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jdguo@imr.ac.cn
关键词	Abnormal Polarity Effect Abnormal Polarity Effect Electromigration Electromigration Intermetallic Compound Intermetallic Compound
URL	查看原文 ; 查看原文
WOS记录号	WOS:000248638600017 ; WOS:000248638600017
引用统计	被引频次：62[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/34051
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. F. Zhang,J. D. Guo,J. K. Shang. Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect, Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect[J]. Scripta Materialia, Scripta Materialia,2007, 2007,57, 57(6):513-516, 513-516.
APA	X. F. Zhang,J. D. Guo,&J. K. Shang.(2007).Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect.Scripta Materialia,57(6),513-516.
MLA	X. F. Zhang,et al."Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect".Scripta Materialia 57.6(2007):513-516.