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Ultrahigh strength and high electrical conductivity in copper
L. Lu; Y. F. Shen; X. H. Chen; L. H. Qian; K. Lu
2004
发表期刊Science
ISSN0036-8075
卷号304期号:5669页码:422-426
摘要Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.
部门归属chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;lu, k (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;lu@imr.ac.cn
关键词Nanocrystalline Copper Resistivity Ductility Behavior Nickel Cu
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WOS记录号WOS:000220845400043
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被引频次:2581[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/35481
专题中国科学院金属研究所
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L. Lu,Y. F. Shen,X. H. Chen,et al. Ultrahigh strength and high electrical conductivity in copper[J]. Science,2004,304(5669):422-426.
APA L. Lu,Y. F. Shen,X. H. Chen,L. H. Qian,&K. Lu.(2004).Ultrahigh strength and high electrical conductivity in copper.Science,304(5669),422-426.
MLA L. Lu,et al."Ultrahigh strength and high electrical conductivity in copper".Science 304.5669(2004):422-426.
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