Ultrahigh strength and high electrical conductivity in copper | |
L. Lu; Y. F. Shen; X. H. Chen; L. H. Qian; K. Lu | |
2004 | |
发表期刊 | Science
![]() |
ISSN | 0036-8075 |
卷号 | 304期号:5669页码:422-426 |
摘要 | Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries. |
部门归属 | chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;lu, k (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;lu@imr.ac.cn |
关键词 | Nanocrystalline Copper Resistivity Ductility Behavior Nickel Cu |
URL | 查看原文 |
WOS记录号 | WOS:000220845400043 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/35481 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | L. Lu,Y. F. Shen,X. H. Chen,et al. Ultrahigh strength and high electrical conductivity in copper[J]. Science,2004,304(5669):422-426. |
APA | L. Lu,Y. F. Shen,X. H. Chen,L. H. Qian,&K. Lu.(2004).Ultrahigh strength and high electrical conductivity in copper.Science,304(5669),422-426. |
MLA | L. Lu,et al."Ultrahigh strength and high electrical conductivity in copper".Science 304.5669(2004):422-426. |
条目包含的文件 | 条目无相关文件。 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论