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Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM
L. Qi; H. F. Zhang; Z. Q. Hu
2004
Source PublicationIntermetallics
ISSN0966-9795
Volume12Issue:10-11Pages:1191-1195
AbstractBased on the embedded-atom method, a constant-pressure, constant-temperature molecular dynamics technique is applied to obtain an atomic description of glass formation process in eutectic Cu40Ag60 alloy. By using radial distribution function and pair analysis methods, the structure and glass forming ability of this alloy is studied by quenching from the liquid at different cooling rates (1 x 10(11), 1 x 10(12), 5 x 10(12), 1 x 10(13) and 1 x 10(14) K/s). It is observed that the retention of amorphous structure requires extremely high cooling rates. Structure analyses of the alloys in the simulations reveal the evolvement of the different clusters at various quenching rate during the quenching process. (C) 2004 Elsevier Ltd. All rights reserved.
description.departmentchinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;hfzhang@imr.ac.cn
KeywordGlasses Simulations Metallic Rapid Solidification Processing Atomistic Embedded-atom-method Transition-metals Fcc Metals Model Amorphization Binding Copper Ni
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WOS IDWOS:000224566700026
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Cited Times:45[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/35513
Collection中国科学院金属研究所
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GB/T 7714
L. Qi,H. F. Zhang,Z. Q. Hu. Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM[J]. Intermetallics,2004,12(10-11):1191-1195.
APA L. Qi,H. F. Zhang,&Z. Q. Hu.(2004).Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM.Intermetallics,12(10-11),1191-1195.
MLA L. Qi,et al."Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM".Intermetallics 12.10-11(2004):1191-1195.
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