Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM

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	Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM
	L. Qi; H. F. Zhang; Z. Q. Hu
	2004
发表期刊	Intermetallics
ISSN	0966-9795
卷号	12 期号:10-11 页码:1191-1195
摘要	Based on the embedded-atom method, a constant-pressure, constant-temperature molecular dynamics technique is applied to obtain an atomic description of glass formation process in eutectic Cu40Ag60 alloy. By using radial distribution function and pair analysis methods, the structure and glass forming ability of this alloy is studied by quenching from the liquid at different cooling rates (1 x 10(11), 1 x 10(12), 5 x 10(12), 1 x 10(13) and 1 x 10(14) K/s). It is observed that the retention of amorphous structure requires extremely high cooling rates. Structure analyses of the alloys in the simulations reveal the evolvement of the different clusters at various quenching rate during the quenching process. (C) 2004 Elsevier Ltd. All rights reserved.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;hfzhang@imr.ac.cn
关键词	Glasses Simulations Metallic Rapid Solidification Processing Atomistic Embedded-atom-method Transition-metals Fcc Metals Model Amorphization Binding Copper Ni
URL	查看原文
WOS记录号	WOS:000224566700026
引用统计	被引频次：45[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/35513
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. Qi,H. F. Zhang,Z. Q. Hu. Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM[J]. Intermetallics,2004,12(10-11):1191-1195.
APA	L. Qi,H. F. Zhang,&Z. Q. Hu.(2004).Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM.Intermetallics,12(10-11),1191-1195.
MLA	L. Qi,et al."Molecular dynamic simulation of glass formation in binary liquid metal: Cu-Ag using EAM".Intermetallics 12.10-11(2004):1191-1195.