| Effect of Pd on GFA and thermal stability of Zr-based bulk amorphous alloy | |
| F. X. Qin; H. F. Zhang; A. M. Wang; B. Z. Ding; Z. Q. Hu | |
| 2004 | |
| Source Publication | Journal of Materials Science & Technology
 |
| ISSN | 1005-0302 |
| Volume | 20Issue:2Pages:160-163 |
| Abstract | The effect of Pd addition on the glass-forming ability and thermal stability of the Zr55Al10Cu30Ni5-xPdx (x=0, 1, 3, 5 at. pct) alloys upon copper-mold casting has been investigated. The structure, thermal stability and microstructure were studied by X-ray diffraction (XRD), differential scanning calorimetry (DSC) and transmission electron microscopy (TEM), respectively. It was identified that a new bulk amorphous alloy with the larger supercooled liquid region DeltaT(x) of 100 K is obtained with substituting Ni by 1 at. pct Pd. Furthermore, the origins that thermal stability and GFA change with increasing of Pd have also beer discussed. |
| description.department | chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;hfzhang@imr.ac.cn |
| Keyword | Bulk Amorphous Alloy Class-forming Ability Thermal Stability Metallic Glasses Mechanical-properties |
| URL | 查看原文 |
| WOS ID | WOS:000220705300009 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/35521 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | F. X. Qin,H. F. Zhang,A. M. Wang,et al. Effect of Pd on GFA and thermal stability of Zr-based bulk amorphous alloy[J]. Journal of Materials Science & Technology,2004,20(2):160-163. |
| APA | F. X. Qin,H. F. Zhang,A. M. Wang,B. Z. Ding,&Z. Q. Hu.(2004).Effect of Pd on GFA and thermal stability of Zr-based bulk amorphous alloy.Journal of Materials Science & Technology,20(2),160-163. |
| MLA | F. X. Qin,et al."Effect of Pd on GFA and thermal stability of Zr-based bulk amorphous alloy".Journal of Materials Science & Technology 20.2(2004):160-163. |
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