| Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling | |
| H. Li; J. B. Li; Z. G. Wang; C. H. Jiang; D. Z. Wang | |
| 1999 | |
| Source Publication | Journal of Materials Science & Technology
 |
| ISSN | 1005-0302 |
| Volume | 15Issue:2Pages:117-120 |
| Abstract | The thermal stress behavior of bonded SiC/6061AL laminates during thermal cycling and the stress relaxation at elevated temperature (205 degrees C) were investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061Al layer took place during thermal cycling, and the same closed stress temperature loop was formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061Al layer at 205 degrees C within the range of 0.5 similar to 16 h, and which was nearly unchanged with further prolongation of time. |
| description.department | acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china. harbin inst technol, sch mat sci & engn, harbin 150001, peoples r china.;wang, zg (reprint author), acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china |
| Keyword | Residual-stress Thin-films Near-interface Temperature Curvature Composite Substrate Formula Layer |
| URL | 查看原文 |
| WOS ID | WOS:000079552000003 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/37400 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | H. Li,J. B. Li,Z. G. Wang,et al. Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling[J]. Journal of Materials Science & Technology,1999,15(2):117-120. |
| APA | H. Li,J. B. Li,Z. G. Wang,C. H. Jiang,&D. Z. Wang.(1999).Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling.Journal of Materials Science & Technology,15(2),117-120. |
| MLA | H. Li,et al."Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling".Journal of Materials Science & Technology 15.2(1999):117-120. |
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