Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling

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	Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling
	H. Li; J. B. Li; Z. G. Wang; C. H. Jiang; D. Z. Wang
	1999
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	15 期号:2 页码:117-120
摘要	The thermal stress behavior of bonded SiC/6061AL laminates during thermal cycling and the stress relaxation at elevated temperature (205 degrees C) were investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061Al layer took place during thermal cycling, and the same closed stress temperature loop was formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061Al layer at 205 degrees C within the range of 0.5 similar to 16 h, and which was nearly unchanged with further prolongation of time.
部门归属	acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china. harbin inst technol, sch mat sci & engn, harbin 150001, peoples r china.;wang, zg (reprint author), acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china
关键词	Residual-stress Thin-films Near-interface Temperature Curvature Composite Substrate Formula Layer
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WOS记录号	WOS:000079552000003
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/37400
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Li,J. B. Li,Z. G. Wang,et al. Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling[J]. Journal of Materials Science & Technology,1999,15(2):117-120.
APA	H. Li,J. B. Li,Z. G. Wang,C. H. Jiang,&D. Z. Wang.(1999).Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling.Journal of Materials Science & Technology,15(2),117-120.
MLA	H. Li,et al."Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling".Journal of Materials Science & Technology 15.2(1999):117-120.