Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints

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	Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints
	C. Chen; L. Zhang; J. X. Zhao; L. H. Cao; J. K. Shang
	2012
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	41 期号:9 页码:2487-2494
摘要	The effect of the gap size on the shear strength of a solder joint was investigated in both Sn/Cu and Sn/FeNi lap solder joints by varying the gap size from 20 mu m to 300 mu m. In the Sn/FeNi joints, the shear strength remained relatively constant, around 14 MPa, independent of the gap size. In contrast, the shear strength of the Sn/Cu joint decreased about 20% from 25 MPa to 20 MPa. The decrease was shown to result from Cu6Sn5 precipitation in the thicker Sn/Cu joint, which was absent in the thinner joints.
部门归属	[chen, cai; zhang, lei; zhao, jiaxi; cao, lihua; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;chen, c (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;lzhang@imr.ac.cn
关键词	Solder Size Effect Shear Strength Microstructure Lead-free Solder Fatigue-crack Initiation Sn-ag Fe-42ni Ni Cu
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/59897
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	C. Chen,L. Zhang,J. X. Zhao,et al. Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints[J]. Journal of Electronic Materials,2012,41(9):2487-2494.
APA	C. Chen,L. Zhang,J. X. Zhao,L. H. Cao,&J. K. Shang.(2012).Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints.Journal of Electronic Materials,41(9),2487-2494.
MLA	C. Chen,et al."Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints".Journal of Electronic Materials 41.9(2012):2487-2494.