A New Crack Healing Kinetic Model and Application of Crack Healing Diagram

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	A New Crack Healing Kinetic Model and Application of Crack Healing Diagram
	Y. Kan; H. Liu; S. H. Zhang; L. W. Zhang; M. Cheng
	2013
发表期刊	Journal of Manufacturing Science and Engineering-Transactions of the Asme
ISSN	1087-1357
卷号	135 期号:5
摘要	An internal crack is a common defect which can lead to failure of the material. There are few published studies which can quantitatively predict healed fractions under given conditions such as temperature, pressure and healing time. In the current study, a new crack healing kinetic model is developed to predict the healed crack fraction under any given temperature, pressure and healing time. In contrast to previous models, this new model describes the crack surface topography as a series of semi spherical pores, and proposes a new diffusion healing mechanism involving grain growth. Plastic deformation, power law creep and diffusion controlled creep mechanism are considered in this model. A crack healing diagram for 34MnV steel is constructed with axes of healed fraction and temperature or pressure. The predictions from the new model compare well with experimental results. The results of the model indicate that the diffusion controlled creep mechanism contributes little at high temperatures because of grain growth. The critical healing time and pressure can be determined by using the crack healing diagram.
部门归属	[kan, y. ; zhang, l. w.] dalian univ technol, sch mat sci & engn, dalian 116024, peoples r china. [kan, y. ; liu, h. ; zhang, s. h. ; cheng, m.] chinese acad sci, inst met res, shenyang 110016, peoples r china. ; ykan@imr.ac.cn ; hliu@imr.ac.cn ; shzhang@imr.ac.cn ; zhanglw@dlut.edu.cn ; mcheng@imr.ac.cn
关键词	Crack Healing Model Healing Diagram Crack Surface Topography Grain Growth Sintering Kinetics Numerical-analysis Diffusion Shrinkage Surface Grain
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/71289
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. Kan,H. Liu,S. H. Zhang,et al. A New Crack Healing Kinetic Model and Application of Crack Healing Diagram[J]. Journal of Manufacturing Science and Engineering-Transactions of the Asme,2013,135(5).
APA	Y. Kan,H. Liu,S. H. Zhang,L. W. Zhang,&M. Cheng.(2013).A New Crack Healing Kinetic Model and Application of Crack Healing Diagram.Journal of Manufacturing Science and Engineering-Transactions of the Asme,135(5).
MLA	Y. Kan,et al."A New Crack Healing Kinetic Model and Application of Crack Healing Diagram".Journal of Manufacturing Science and Engineering-Transactions of the Asme 135.5(2013).