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Electroless Deposition of Highly Solderable Fe-Ni Films
H. F. Zhou; J. D. Guo; J. K. Shang
2013
Source PublicationJournal of the Electrochemical Society
ISSN0013-4651
Volume160Issue:6Pages:D233-D239
AbstractThe simultaneous electroless-deposition of Fe and Ni is challenging because Fe has a more negative standard reduction potential than Ni. In this study, FeNiP electroless deposits with Fe content up to 97 at.% were prepared by complexing with disodium ethylene diamine tetraacetate (EDTA-2Na). The addition of ETDA-2Na complexing agent effectively reduced the difference in the electrode potential between Ni and Fe from 0.21 V to 0.156 V, resulting in Fe-Ni depositions with very high Fe concentrations. The iron concentrations of deposited films were systematically investigated as functions of bath temperature, concentrations of EDTA-2Na and DTPA, mole ratio of Fe2+/Ni2+ and contents of NH3 center dot H2O in the plating bath. The solderability of electroless FeNiP deposits with Sn and SnAgCu solders was found to increase with the iron content in the deposits from 0 at.% to 85 at.%, and to be better than that of the electroless NiP. (C) 2013 The Electrochemical Society. All rights reserved.
description.department[zhou, haifei ; guo, jingdong ; shang, jianku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zhou, haifei] zhejiang elect power corp res inst, hangzhou 310014, zhejiang, peoples r china. [shang, jianku] univ illinois, dept mat sci & engn, urbana, il 61801 usa. ; zhou, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; jdguo@imr.ac.cn ; jkshang@imr.ac.cn
KeywordNickel-phosphorus p Alloys Nanoparticles Systems Joints Cu
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Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/71740
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
H. F. Zhou,J. D. Guo,J. K. Shang. Electroless Deposition of Highly Solderable Fe-Ni Films[J]. Journal of the Electrochemical Society,2013,160(6):D233-D239.
APA H. F. Zhou,J. D. Guo,&J. K. Shang.(2013).Electroless Deposition of Highly Solderable Fe-Ni Films.Journal of the Electrochemical Society,160(6),D233-D239.
MLA H. F. Zhou,et al."Electroless Deposition of Highly Solderable Fe-Ni Films".Journal of the Electrochemical Society 160.6(2013):D233-D239.
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