Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites

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	Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites
	Y. Kan; Z. G. Liu; S. H. Zhang; L. W. Zhang; M. Cheng; H. W. Song
	2014
发表期刊	Journal of Materials Engineering and Performance
ISSN	1059-9495
卷号	23 期号:3 页码:1069-1076
摘要	Modeling and prediction of the damage evolution in particle reinforced composites is a complex problem. Microstructure characters such as the particle morphologies, sizes, and distribution significantly affect the damage evolution in composites. A numerical simulation has been performed to investigate the damage evolution of SiCp/AA2009 composites. Tensile deformation in SiCp/AA2009 composites was simulated using the microstructure-based model constructed from the metallograph. Matrix damage, particle cracking, and interface debonding were simulated combining the ductile damage model, the normal stress criterion, and the maximum stress ratio criterion. The simulation results show that under tensile loading, damage initiates at the interface, and then propagates along the weakest direction. The simulation microstructures agree well with experimental results in which interface debonding, particle cracking, and matrix damage co-exist. In addition, the effects of component properties on the damage evolution are examined for various situations.
部门归属	[kan, y. ; liu, z. g. ; zhang, s. h. ; cheng, m. ; song, h. w.] chinese acad sci, inst met res, shenyang 110016, peoples r china. [kan, y. ; zhang, l. w.] dalian univ technol, sch mat sci & engn, dalian 116024, peoples r china. ; kan, y (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china. ; ykan@imr.ac.cn ; mcheng@imr.ac.cn
关键词	Damage Evolution Interface Debonding Microstructure-based Model Sicp/al Composites Metal-matrix Composites Computational Micromechanics Mechanical-behavior Damage Model Property Deformation Decohesion Fracture Flow
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72549
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. Kan,Z. G. Liu,S. H. Zhang,et al. Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites[J]. Journal of Materials Engineering and Performance,2014,23(3):1069-1076.
APA	Y. Kan,Z. G. Liu,S. H. Zhang,L. W. Zhang,M. Cheng,&H. W. Song.(2014).Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites.Journal of Materials Engineering and Performance,23(3),1069-1076.
MLA	Y. Kan,et al."Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites".Journal of Materials Engineering and Performance 23.3(2014):1069-1076.