Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging

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	Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging
	Z. Q. Liu; P. J. Shang; F. F. Tan; D. X. Li
	2013
发表期刊	Microscopy and Microanalysis
ISSN	1431-9276
卷号	19 页码:105-108
摘要	Kirkendall void formation at the solder/metallization interface is an important reliability concern for Cu conductors and under-bump metallization in microelectronic packaging industry, whose mechanism is still hard to be understood for different individual cases. In the present work, two typical solder/Cu-diffusing couples, eutectic SnIn/Cu and SnBi/Cu, were studied by scanning/transmission electron microscopy to investigate the microstructural evolution and voiding process after soldering and then solid-state aging. It was concluded that Kirkendall voids formed between two sublayers within Cu-2(In, Sn) phase in eutectic SnIn/Cu solder joint, whereas they appeared at the Cu3Sn/Cu interface or within Cu3Sn for eutectic SnBi/Cu solder joint. Besides the effect of impurity elements, the morphological difference within one intermetallic compound layer could change the diffusing rates of reactive species, hence resulting in void formation in the reaction zone.
部门归属	[liu, zhi-quan ; shang, pan-ju ; tan, feifei ; li, douxing] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, liaoning, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, liaoning, peoples r china. ; zqliu@imr.ac.cn
关键词	Lead-free Solder Kirkendall Void Intermetallic Compound (Imc) Diffusion Interface Transmission Electron Microscopy (Tem) Cu
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72559
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Z. Q. Liu,P. J. Shang,F. F. Tan,et al. Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging[J]. Microscopy and Microanalysis,2013,19:105-108.
APA	Z. Q. Liu,P. J. Shang,F. F. Tan,&D. X. Li.(2013).Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging.Microscopy and Microanalysis,19,105-108.
MLA	Z. Q. Liu,et al."Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging".Microscopy and Microanalysis 19(2013):105-108.