Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint

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	Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint
	F. F. Tian; P. J. Shang; Z. Q. Liu
	2014
发表期刊	Materials Letters
ISSN	0167-577X
卷号	121 页码:185-187
摘要	To clarify the interfacial reactions in a liquid-solid system like solder joint, the location of reactive interface is very critical for mechanism investigation, which is hard to be determined due to its reactivity. Electroplated Cr-marker experiments were firstly applied to study the intermetallic compounds growth and Kirkendall voids formation in the solder joint between eutectic Snln and polycrystalline Cu. The original interface between Cu and liquid Snln solder was revealed being the reactive interface within the duplex structural Cu2(In,Sn) compounds, where the fine-grain sublayer grew into substrate side while the coarse-grain sublayer grew into solder side. This interface was also determined as the Kirkendall void plane between the coarse- and fine-grain Cu-2(In,Sn) sublayers, which is different from those between Cu substrate and intermetallic compound layer in other solder joints. This Kirkendall void plane remained stable during solid-state aging with increased void size, which could degrade the mechanical and electrical properties of the solder joint. (C) 2014 Elsevier B.V. All rights reserved.
部门归属	[tian, feifei ; shang, pan-ju ; liu, zhi-quan] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; zqliu@imr.ac.cn
关键词	Interfaces Intermetallic Alloys And Compounds Diffusion Kirkendall Void Snin Solder Cu Substrate Growth-kinetics Snagcu Solder Diffusion Compound Identification Ni
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72913
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	F. F. Tian,P. J. Shang,Z. Q. Liu. Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint[J]. Materials Letters,2014,121:185-187.
APA	F. F. Tian,P. J. Shang,&Z. Q. Liu.(2014).Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint.Materials Letters,121,185-187.
MLA	F. F. Tian,et al."Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint".Materials Letters 121(2014):185-187.