Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study

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	Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study
	K.; Kong Wang, L. Y.; Tao, Y. S.; Li, T. F.; Xiong, T. Y.
	2015
发表期刊	Journal of Thermal Spray Technology
ISSN	1059-9630
卷号	24 期号:42006 页码:75-85
摘要	In this work, finite element simulations were performed to investigate the competition between bonding and rebounding when a Cu particle of 25 mu m in diameter impinged Cu substrate. With the help of cohesive zone model, the trend of the minimal average bonding strength to suppress rebounding (MABSSR) was predicted as a function of initial velocity under certain conditions. Result shows, MABSSR has a nonlinear trend versus initial velocity under the conditions considered. If the real trend of MABSSR is similar to that observed, a hypothesis is presented to explain the critical deposition velocity. Finally, defects in the current work are discussed. Analysis shows the defects have no influence on predicting the overall trend of MABSSR in the current work.
部门归属	[wang, kai ; kong, lingyan ; tao, yongshan ; li, tiefan ; xiong, tianying] chinese acad sci, inst met res, shenyang 110016, peoples r china. ; wang, k (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china. ; tyxiong@imr.ac.cn
关键词	Adhesion Energy Bonding Mechanism Bonding Strength Cold Spraying Contact Area Finite Element Method (Fem) Rebounding Energy Powder Particles Copper Coatings Deposition Deformation Mechanism Friction Solids Metal
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/73953
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	K.,Kong Wang, L. Y.,Tao, Y. S.,et al. Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study[J]. Journal of Thermal Spray Technology,2015,24(42006):75-85.
APA	K.,Kong Wang, L. Y.,Tao, Y. S.,Li, T. F.,&Xiong, T. Y..(2015).Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study.Journal of Thermal Spray Technology,24(42006),75-85.
MLA	K.,et al."Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study".Journal of Thermal Spray Technology 24.42006(2015):75-85.