Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine

IMR OpenIR

	Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine
	Ren, Rong; Xiong, Xuhai; Ma, Xinghua; Liu, Siyang; Wang, Jing; Chen, Ping; Zeng, You; xiongxuhai@sau.edu.cn
	2016
发表期刊	THERMOCHIMICA ACTA
ISSN	0040-6031
卷号	623 页码:15-21
摘要	The curing reaction of diglycidyl ether of bisphenol A (DGEBA) with a novel aromatic diamine containing phthalide structure (BAPP) was studied by differential scanning calorimetery (DSC). The optimal formulation of DGEBA/BAPP system was obtained in terms of the curing behavior and glass transition temperature determined by dynamic DSC. The nth-order reaction model and autocatalytic model were used to analyze the curing kinetics and mechanism based on the isothermal DSC technique. The results indicated that the Kamal autocatalytic model had a great agreement with the experimental data from the start of curing reaction to the initiation of diffusion control stage. Diffusion-controlled effect was also taken into account and then the extended Kamal model could describe precisely the curing reaction of BAPP/DGEBA in the entire conversion range. (C) 2015 Elsevier B.V. All rights reserved.
部门归属	[ren, rong ; xiong, xuhai ; ma, xinghua ; wang, jing] shenyang aerosp univ, liaoning key lab adv polymer matrix composites, 37 daoyi south ave, shenyang 110136, peoples r china ; [liu, siyang ; chen, ping] dalian univ technol, sch chem engn, state key lab fine chem, dalian 116012, peoples r china ; [xiong, xuhai ; zeng, you] chinese acad sci, inst met res, adv carbon div, shenyang natl lab mat sci, shenyang 110016, peoples r china
关键词	Epoxy Resin Aromatic Diamine Curing Kinetics Isothermal Dsc Diffusion Control
资助者	National Natural Science Foundation of China [51303107]; Liaoning Key Laboratory Fundamental Research Project [LZ2015058]; Aerospace Science Foundation of China [2014ZF54030]; National Defense 12th Five-Year Fundamental Research Program [A352010****]; Shenyang National Laboratory for Material Science [2015RP13]
收录类别	sci
语种	英语
WOS记录号	WOS:000369214800003
引用统计	被引频次：46[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/74935
专题	中国科学院金属研究所
通讯作者	xiongxuhai@sau.edu.cn
推荐引用方式 GB/T 7714	Ren, Rong,Xiong, Xuhai,Ma, Xinghua,et al. Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine[J]. THERMOCHIMICA ACTA,2016,623:15-21.
APA	Ren, Rong.,Xiong, Xuhai.,Ma, Xinghua.,Liu, Siyang.,Wang, Jing.,...&xiongxuhai@sau.edu.cn.(2016).Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine.THERMOCHIMICA ACTA,623,15-21.
MLA	Ren, Rong,et al."Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine".THERMOCHIMICA ACTA 623(2016):15-21.