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Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects
Chen, Jian-Qiang; Guo, Jing-Dong; Ma, Hui-Cai; Liu, Kai-Lang; Zhu, Qing-sheng; Shang, Jian Ku; jdguo@imr.ac.cn
2015
Source PublicationJOURNAL OF MATERIALS RESEARCH
ISSN0884-2914
Volume30Issue:8Pages:1065-1071
AbstractSn-Ag-Cu solder interconnects were made by solidifying the solder balls in a magnetic field and subsequently tested for their electromigration behavior. The orientation of the tin grains was analyzed by electron backscattered diffraction. It was found that the c-axis of Sn grain tended to rotate away from the direction of the magnetic field during solidification, resulting in an enhanced electromigration resistance for the solder joint when the current was applied along the direction of the magnetic field, as evidenced by a smaller electromigration-induced polarity effect in the growth of the interfacial intermetallic compound. Such a reduced polarity-effect of electromigration is shown to agree well with the anisotropy in the diffusivity of the active diffusion species, Cu, in the tetragonal Sn. The difference of free energy change caused by the anisotropy in the magnetic susceptibility of the tetragonal Sn during solidification is suggested to be the main factor for this phenomenon.
description.department[chen, jian-qiang ; guo, jing-dong ; ma, hui-cai ; liu, kai-lang ; zhu, qing-sheng ; shang, jian ku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china ; [shang, jian ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa
Funding OrganizationNational Basic Research Program of China [2010CB631006]; Natural Science Foundation of China [51171191, 51101161]; Major National Science and Technology Program of China [2011ZX02602]; National key scientific instrument and equipment development projects of China [2013YQ120355]; Natural Science Foundation of Liaoning Province [2013020015]
Indexed Bysci
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/74953
Collection中国科学院金属研究所
Corresponding Authorjdguo@imr.ac.cn
Recommended Citation
GB/T 7714
Chen, Jian-Qiang,Guo, Jing-Dong,Ma, Hui-Cai,et al. Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects[J]. JOURNAL OF MATERIALS RESEARCH,2015,30(8):1065-1071.
APA Chen, Jian-Qiang.,Guo, Jing-Dong.,Ma, Hui-Cai.,Liu, Kai-Lang.,Zhu, Qing-sheng.,...&jdguo@imr.ac.cn.(2015).Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects.JOURNAL OF MATERIALS RESEARCH,30(8),1065-1071.
MLA Chen, Jian-Qiang,et al."Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects".JOURNAL OF MATERIALS RESEARCH 30.8(2015):1065-1071.
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