Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects

IMR OpenIR

	Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects
	Chen, Jian-Qiang; Guo, Jing-Dong; Ma, Hui-Cai; Liu, Kai-Lang; Zhu, Qing-sheng; Shang, Jian Ku; jdguo@imr.ac.cn
	2015
发表期刊	JOURNAL OF MATERIALS RESEARCH
ISSN	0884-2914
卷号	30 期号:8 页码:1065-1071
摘要	Sn-Ag-Cu solder interconnects were made by solidifying the solder balls in a magnetic field and subsequently tested for their electromigration behavior. The orientation of the tin grains was analyzed by electron backscattered diffraction. It was found that the c-axis of Sn grain tended to rotate away from the direction of the magnetic field during solidification, resulting in an enhanced electromigration resistance for the solder joint when the current was applied along the direction of the magnetic field, as evidenced by a smaller electromigration-induced polarity effect in the growth of the interfacial intermetallic compound. Such a reduced polarity-effect of electromigration is shown to agree well with the anisotropy in the diffusivity of the active diffusion species, Cu, in the tetragonal Sn. The difference of free energy change caused by the anisotropy in the magnetic susceptibility of the tetragonal Sn during solidification is suggested to be the main factor for this phenomenon.
部门归属	[chen, jian-qiang ; guo, jing-dong ; ma, hui-cai ; liu, kai-lang ; zhu, qing-sheng ; shang, jian ku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china ; [shang, jian ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa
资助者	National Basic Research Program of China [2010CB631006]; Natural Science Foundation of China [51171191, 51101161]; Major National Science and Technology Program of China [2011ZX02602]; National key scientific instrument and equipment development projects of China [2013YQ120355]; Natural Science Foundation of Liaoning Province [2013020015]
收录类别	sci
语种	英语
WOS记录号	WOS:000355282900003
引用统计	被引频次：9[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/74953
专题	中国科学院金属研究所
通讯作者	jdguo@imr.ac.cn
推荐引用方式 GB/T 7714	Chen, Jian-Qiang,Guo, Jing-Dong,Ma, Hui-Cai,et al. Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects[J]. JOURNAL OF MATERIALS RESEARCH,2015,30(8):1065-1071.
APA	Chen, Jian-Qiang.,Guo, Jing-Dong.,Ma, Hui-Cai.,Liu, Kai-Lang.,Zhu, Qing-sheng.,...&jdguo@imr.ac.cn.(2015).Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects.JOURNAL OF MATERIALS RESEARCH,30(8),1065-1071.
MLA	Chen, Jian-Qiang,et al."Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects".JOURNAL OF MATERIALS RESEARCH 30.8(2015):1065-1071.