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Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars
Li, L. L.; Zhang, Z. J.; Tan, J.; Jiang, C. B.; Qu, R. T.; Zhang, P.; Yang, J. B.; Zhang, Z. F.; zhfzhang@imr.ac.cn
2015
Source PublicationSCIENTIFIC REPORTS
ISSN2045-2322
Volume5Pages:-
AbstractVast experiments have demonstrated that the external specimen size makes a large difference in the deformation behavior of crystalline materials. However, as one important kind of internal planar defects, the role of grain boundary (GB) in small scales needs to be clarified in light of the scarce and inconsistent experimental results at present. Through compression of Cu bicrystal and its counterpart monocrystal micropillars, it is found that, in contrast to the monocrystals, the bicrystals are characterized by work hardening with discrete strain bursts. Interestingly, the stress rise between two adjacent strain bursts of the bicrystals increases with the decrease of specimen size. The results suggest that GBs play a critical role in the work hardening of materials in small scales, which may provide important implications to further understand the general work hardening behaviors of materials in the future.
description.department[li, l. l. ; zhang, z. j. ; tan, j. ; jiang, c. b. ; qu, r. t. ; zhang, p. ; yang, j. b. ; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china
Funding OrganizationNational Natural Science Foundation of China (NSFC) [51171194, 51331007, 51471170]; IMR SYNL-T.S. Ke Research Fellowship
Indexed Bysci
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/75131
Collection中国科学院金属研究所
Corresponding Authorzhfzhang@imr.ac.cn
Recommended Citation
GB/T 7714
Li, L. L.,Zhang, Z. J.,Tan, J.,et al. Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars[J]. SCIENTIFIC REPORTS,2015,5:-.
APA Li, L. L..,Zhang, Z. J..,Tan, J..,Jiang, C. B..,Qu, R. T..,...&zhfzhang@imr.ac.cn.(2015).Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars.SCIENTIFIC REPORTS,5,-.
MLA Li, L. L.,et al."Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars".SCIENTIFIC REPORTS 5(2015):-.
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