Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars

IMR OpenIR

	Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars
	Li, L. L.; Zhang, Z. J.; Tan, J.; Jiang, C. B.; Qu, R. T.; Zhang, P.; Yang, J. B.; Zhang, Z. F.; zhfzhang@imr.ac.cn
	2015
发表期刊	SCIENTIFIC REPORTS
ISSN	2045-2322
卷号	5 页码:-
摘要	Vast experiments have demonstrated that the external specimen size makes a large difference in the deformation behavior of crystalline materials. However, as one important kind of internal planar defects, the role of grain boundary (GB) in small scales needs to be clarified in light of the scarce and inconsistent experimental results at present. Through compression of Cu bicrystal and its counterpart monocrystal micropillars, it is found that, in contrast to the monocrystals, the bicrystals are characterized by work hardening with discrete strain bursts. Interestingly, the stress rise between two adjacent strain bursts of the bicrystals increases with the decrease of specimen size. The results suggest that GBs play a critical role in the work hardening of materials in small scales, which may provide important implications to further understand the general work hardening behaviors of materials in the future.
部门归属	[li, l. l. ; zhang, z. j. ; tan, j. ; jiang, c. b. ; qu, r. t. ; zhang, p. ; yang, j. b. ; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china
资助者	National Natural Science Foundation of China (NSFC) [51171194, 51331007, 51471170]; IMR SYNL-T.S. Ke Research Fellowship
收录类别	sci
语种	英语
WOS记录号	WOS:000363142300004
引用统计	被引频次：13[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/75131
专题	中国科学院金属研究所
通讯作者	zhfzhang@imr.ac.cn
推荐引用方式 GB/T 7714	Li, L. L.,Zhang, Z. J.,Tan, J.,et al. Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars[J]. SCIENTIFIC REPORTS,2015,5:-.
APA	Li, L. L..,Zhang, Z. J..,Tan, J..,Jiang, C. B..,Qu, R. T..,...&zhfzhang@imr.ac.cn.(2015).Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars.SCIENTIFIC REPORTS,5,-.
MLA	Li, L. L.,et al."Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars".SCIENTIFIC REPORTS 5(2015):-.