Electromigration anisotropy introduced by tin orientation in solder joints

IMR OpenIR

	Electromigration anisotropy introduced by tin orientation in solder joints
	Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku; Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
	2017-05-05
发表期刊	JOURNAL OF ALLOYS AND COMPOUNDS
ISSN	0925-8388
卷号	703 页码:264-271
摘要	Single-crystal Sn/Cu solder joints with (001), (101), (301) and (100) plane of Sn as the interfaces were prepared for studying the relation between orientation of Sn and electromigration. The growth of interfacial intermetallic compounds was found to strongly depend on the Sn grain orientation. When the c-axis was parallel to the current direction, a severe polarity effect was observed, while the c-axis of Sn off the current direction, the polarity effect became less pronounced. For (101) and (301) orientation samples making a 28.6 degrees and 58.6 degrees angles with c-axis of Sn, asymmetrical IMCs layer growth at the anode interface, downward sloping serrated edges of Cu dissolution groove at the cathode and granular Cu6Sn5 growth at the surface were observed, while these morphological features were not found in (001) and (100) samples making a 0 degrees and 90 degrees angles with c-axis of Sn. It is suggested that when the c-axis of beta-Sn was off the current direction, the direction of Cu atoms diffusion is shifted to the c-axis of tin grain under the electromigration driving force.(C) 2017 Elsevier B.V. All rights reserved.; Single-crystal Sn/Cu solder joints with (001), (101), (301) and (100) plane of Sn as the interfaces were prepared for studying the relation between orientation of Sn and electromigration. The growth of interfacial intermetallic compounds was found to strongly depend on the Sn grain orientation. When the c-axis was parallel to the current direction, a severe polarity effect was observed, while the c-axis of Sn off the current direction, the polarity effect became less pronounced. For (101) and (301) orientation samples making a 28.6 degrees and 58.6 degrees angles with c-axis of Sn, asymmetrical IMCs layer growth at the anode interface, downward sloping serrated edges of Cu dissolution groove at the cathode and granular Cu6Sn5 growth at the surface were observed, while these morphological features were not found in (001) and (100) samples making a 0 degrees and 90 degrees angles with c-axis of Sn. It is suggested that when the c-axis of beta-Sn was off the current direction, the direction of Cu atoms diffusion is shifted to the c-axis of tin grain under the electromigration driving force.(C) 2017 Elsevier B.V. All rights reserved.
部门归属	[chen, jian-qiang ; liu, kai-lang ; guo, jing-dong ; ma, hui-cai ; wei, song] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china ; [chen, jian-qiang] harbin inst technol, shenzhen grad sch, shenzhen 518055, peoples r china ; [shang, jian-ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa
关键词	Electromigration Single Crystal Tin Cu6sn5 Intermetallic Compounds Orientation Diffusion
学科领域	Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
资助者	Natural Science Foundation of China [51171191]; National key Scientific Instrument and Equipment development projects of China [2013YQ120355]
收录类别	SCI
语种	英语
WOS记录号	WOS:000397634000035
引用统计	被引频次：21[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/78146
专题	中国科学院金属研究所
通讯作者	Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
推荐引用方式 GB/T 7714	Chen, Jian-Qiang,Liu, Kai-Lang,Guo, Jing-Dong,et al. Electromigration anisotropy introduced by tin orientation in solder joints[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2017,703:264-271.
APA	Chen, Jian-Qiang.,Liu, Kai-Lang.,Guo, Jing-Dong.,Ma, Hui-Cai.,Wei, Song.,...&Guo, JD .(2017).Electromigration anisotropy introduced by tin orientation in solder joints.JOURNAL OF ALLOYS AND COMPOUNDS,703,264-271.
MLA	Chen, Jian-Qiang,et al."Electromigration anisotropy introduced by tin orientation in solder joints".JOURNAL OF ALLOYS AND COMPOUNDS 703(2017):264-271.