| Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress | |
| Chen, Jian-Qiang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku; Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China. | |
| 2017-02-25 | |
| Source Publication | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| ISSN | 0925-8388 |
| Volume | 695Pages:3290-3298 |
| Abstract | The orientations of Cu6Sn5 grains grown on (001), (011) and (301) Sn single crystals plated with Cu were investigated under electrical loading. After current stressing, anode Cu6Sn5 grains preferred the following orientation relationships with Sn: {- 111}(Sn)//{01-10}(Cu6Sn5), < 0-11 >(Sn)//< 2-1-13 >(Cu6Sn5). Four different Cu6Sn5 orientations were found in anode of (001) Sn/Cu joints, where the coherent interface, {- 111} Sn//{0110} Cu6Sn5, makes a 37.7 degrees angle with the initial interface. Only two orientations were found in the (301) Sn/Cu joint, where the undiscovered orientations with coherent interfaces were nearly vertical to the initial interface. In (101) Sn/Cu joints, the Cu6Sn5 grains with a 25.6 degrees angle between coherent interfaces and the initial interface are much more numerous than with a high angle (60.8 degrees). The results show that Cu6Sn5 grains with a low angle between the coherent interfaces and the initial interface form preferentially during the electromigration process. In addition, cline Cu6Sn5 grain boundaries were observed. A thermodynamics model based on coherent interfacial energy was presented to explain the relations and the formation of cline Cu6Sn5 grain boundaries. It suggests that only when the angle between the coherent interface and the initial interface is lower than a threshold value will the relation form for the lower free energies. (C) 2016 Elsevier B.V. All rights reserved.; The orientations of Cu6Sn5 grains grown on (001), (011) and (301) Sn single crystals plated with Cu were investigated under electrical loading. After current stressing, anode Cu6Sn5 grains preferred the following orientation relationships with Sn: {- 111}(Sn)//{01-10}(Cu6Sn5), < 0-11 >(Sn)//< 2-1-13 >(Cu6Sn5). Four different Cu6Sn5 orientations were found in anode of (001) Sn/Cu joints, where the coherent interface, {- 111} Sn//{0110} Cu6Sn5, makes a 37.7 degrees angle with the initial interface. Only two orientations were found in the (301) Sn/Cu joint, where the undiscovered orientations with coherent interfaces were nearly vertical to the initial interface. In (101) Sn/Cu joints, the Cu6Sn5 grains with a 25.6 degrees angle between coherent interfaces and the initial interface are much more numerous than with a high angle (60.8 degrees). The results show that Cu6Sn5 grains with a low angle between the coherent interfaces and the initial interface form preferentially during the electromigration process. In addition, cline Cu6Sn5 grain boundaries were observed. A thermodynamics model based on coherent interfacial energy was presented to explain the relations and the formation of cline Cu6Sn5 grain boundaries. It suggests that only when the angle between the coherent interface and the initial interface is lower than a threshold value will the relation form for the lower free energies. (C) 2016 Elsevier B.V. All rights reserved. |
| description.department | [chen, jian-qiang ; guo, jing-dong ; ma, hui-cai ; wei, song] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china ; [shang, jian-ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa |
| Keyword | Cu6sn5 Tin Orientation Solid State Reaction Electromigration |
| Subject Area | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| Funding Organization | National Basic Research Program of China [2010CB631006]; Natural Science Foundation of China [51171191]; Major National Science and Technology Program of China [2011ZX02602]; National Key Scientific Instrument and Equipment Development Projects of China [2013YQ120355]; Natural Science Foundation of Liaoning Province [2013020015] |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000391818100045 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/78284 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China. |
| Recommended Citation GB/T 7714 | Chen, Jian-Qiang,Guo, Jing-Dong,Ma, Hui-Cai,et al. Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:3290-3298. |
| APA | Chen, Jian-Qiang,Guo, Jing-Dong,Ma, Hui-Cai,Wei, Song,Shang, Jian-Ku,&Guo, JD .(2017).Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress.JOURNAL OF ALLOYS AND COMPOUNDS,695,3290-3298. |
| MLA | Chen, Jian-Qiang,et al."Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress".JOURNAL OF ALLOYS AND COMPOUNDS 695(2017):3290-3298. |
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